JPWO2022064917A1 - - Google Patents

Info

Publication number
JPWO2022064917A1
JPWO2022064917A1 JP2022551204A JP2022551204A JPWO2022064917A1 JP WO2022064917 A1 JPWO2022064917 A1 JP WO2022064917A1 JP 2022551204 A JP2022551204 A JP 2022551204A JP 2022551204 A JP2022551204 A JP 2022551204A JP WO2022064917 A1 JPWO2022064917 A1 JP WO2022064917A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022551204A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022064917A1 publication Critical patent/JPWO2022064917A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2022551204A 2020-09-25 2021-08-20 Pending JPWO2022064917A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020161178 2020-09-25
PCT/JP2021/030563 WO2022064917A1 (ja) 2020-09-25 2021-08-20 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法

Publications (1)

Publication Number Publication Date
JPWO2022064917A1 true JPWO2022064917A1 (ja) 2022-03-31

Family

ID=80845149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022551204A Pending JPWO2022064917A1 (ja) 2020-09-25 2021-08-20

Country Status (5)

Country Link
JP (1) JPWO2022064917A1 (ja)
KR (1) KR20230043155A (ja)
CN (1) CN115989457A (ja)
TW (1) TW202212992A (ja)
WO (1) WO2022064917A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115947940A (zh) * 2023-01-10 2023-04-11 山东大学 一种具有双功能的光敏聚酰亚胺前体材料及其制备方法与在光刻中的应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06348039A (ja) * 1993-06-14 1994-12-22 Mitsubishi Kasei Corp 感光性平版印刷版の製版方法
JP3100041B2 (ja) * 1997-07-04 2000-10-16 日本合成化学工業株式会社 レジストパターン形成方法
JP4683763B2 (ja) * 2001-05-11 2011-05-18 リコー光学株式会社 高分子材料層の加熱方法及び装置
US20110144297A1 (en) 2009-12-15 2011-06-16 E. I. Du Pont De Nemours And Company Rapid thermal conversion of a polyamic acid fiber to a polyimide fiber
TW201741772A (zh) * 2016-02-26 2017-12-01 富士軟片股份有限公司 積層體的製造方法及半導體元件的製造方法
JP7327983B2 (ja) 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物
JP2020154205A (ja) * 2019-03-22 2020-09-24 富士フイルム株式会社 パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス

Also Published As

Publication number Publication date
WO2022064917A1 (ja) 2022-03-31
CN115989457A (zh) 2023-04-18
TW202212992A (zh) 2022-04-01
KR20230043155A (ko) 2023-03-30

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