JPWO2022039093A1 - - Google Patents

Info

Publication number
JPWO2022039093A1
JPWO2022039093A1 JP2022543914A JP2022543914A JPWO2022039093A1 JP WO2022039093 A1 JPWO2022039093 A1 JP WO2022039093A1 JP 2022543914 A JP2022543914 A JP 2022543914A JP 2022543914 A JP2022543914 A JP 2022543914A JP WO2022039093 A1 JPWO2022039093 A1 JP WO2022039093A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022543914A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022039093A1 publication Critical patent/JPWO2022039093A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022543914A 2020-08-18 2021-08-11 Pending JPWO2022039093A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020138301 2020-08-18
PCT/JP2021/029686 WO2022039093A1 (ja) 2020-08-18 2021-08-11 電力変換装置、電力変換装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022039093A1 true JPWO2022039093A1 (ja) 2022-02-24

Family

ID=80322759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543914A Pending JPWO2022039093A1 (ja) 2020-08-18 2021-08-11

Country Status (5)

Country Link
US (1) US20240030827A1 (ja)
JP (1) JPWO2022039093A1 (ja)
CN (1) CN115943554A (ja)
DE (1) DE112021002637T5 (ja)
WO (1) WO2022039093A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3050681B2 (ja) * 1992-02-21 2000-06-12 インターユニット株式会社 半導体スタック
IT1293021B1 (it) * 1997-07-10 1999-02-11 Sme Elettronica Spa Modulo di potenza a semiconduttori.
JP5532001B2 (ja) * 2011-03-29 2014-06-25 株式会社デンソー 電力変換装置
JP5737275B2 (ja) * 2012-11-29 2015-06-17 株式会社豊田自動織機 インバータ装置
JP6088903B2 (ja) 2013-05-21 2017-03-01 トヨタ自動車株式会社 電力変換装置
JP5862646B2 (ja) * 2013-12-04 2016-02-16 トヨタ自動車株式会社 冷媒管の連結構造及び冷却器内蔵インバータ
JP6729076B2 (ja) * 2016-06-30 2020-07-22 日産自動車株式会社 インバータトレイ及びその製造方法
JP6596398B2 (ja) * 2016-08-29 2019-10-23 本田技研工業株式会社 電力変換装置

Also Published As

Publication number Publication date
DE112021002637T5 (de) 2023-03-02
US20240030827A1 (en) 2024-01-25
WO2022039093A1 (ja) 2022-02-24
CN115943554A (zh) 2023-04-07

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