JPWO2022030445A1 - - Google Patents
Info
- Publication number
- JPWO2022030445A1 JPWO2022030445A1 JP2022541534A JP2022541534A JPWO2022030445A1 JP WO2022030445 A1 JPWO2022030445 A1 JP WO2022030445A1 JP 2022541534 A JP2022541534 A JP 2022541534A JP 2022541534 A JP2022541534 A JP 2022541534A JP WO2022030445 A1 JPWO2022030445 A1 JP WO2022030445A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/14—Esterification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023222707A JP2024038213A (en) | 2020-08-03 | 2023-12-28 | Copolymer, copolymer solution, photosensitive resin composition, cured product, production method for copolymer, and production method for copolymer solution |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020132001 | 2020-08-03 | ||
| JP2020132001 | 2020-08-03 | ||
| JP2021033804 | 2021-03-03 | ||
| JP2021033804 | 2021-03-03 | ||
| PCT/JP2021/028611 WO2022030445A1 (en) | 2020-08-03 | 2021-08-02 | Copolymer, copolymer solution, photosensitive resin composition, cured article, method for producing copolymer, and method for producing copolymer solution |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023222707A Division JP2024038213A (en) | 2020-08-03 | 2023-12-28 | Copolymer, copolymer solution, photosensitive resin composition, cured product, production method for copolymer, and production method for copolymer solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022030445A1 true JPWO2022030445A1 (en) | 2022-02-10 |
| JP7415014B2 JP7415014B2 (en) | 2024-01-16 |
Family
ID=80118000
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022541534A Active JP7415014B2 (en) | 2020-08-03 | 2021-08-02 | Copolymer, copolymer solution, photosensitive resin composition, cured product, method for producing copolymer, and method for producing copolymer solution |
| JP2023222707A Pending JP2024038213A (en) | 2020-08-03 | 2023-12-28 | Copolymer, copolymer solution, photosensitive resin composition, cured product, production method for copolymer, and production method for copolymer solution |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023222707A Pending JP2024038213A (en) | 2020-08-03 | 2023-12-28 | Copolymer, copolymer solution, photosensitive resin composition, cured product, production method for copolymer, and production method for copolymer solution |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7415014B2 (en) |
| KR (1) | KR20230015406A (en) |
| CN (1) | CN116057088A (en) |
| TW (1) | TW202216812A (en) |
| WO (1) | WO2022030445A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024024195A1 (en) * | 2022-07-25 | 2024-02-01 | 株式会社レゾナック | Photosensitive resin composition, resin cured film and image display element |
| CN117069918B (en) * | 2023-08-21 | 2024-04-26 | 广东嘉元新材料有限公司 | Modified acrylic resin and preparation method thereof |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52123427A (en) * | 1976-04-09 | 1977-10-17 | Dainippon Ink & Chem Inc | Resin composition for powder coating |
| JPH0726042B2 (en) * | 1984-11-05 | 1995-03-22 | 三井東圧化学株式会社 | Powder coating composition |
| JPS62256806A (en) * | 1986-04-30 | 1987-11-09 | Japan Synthetic Rubber Co Ltd | Acrylic random copolymer and thermosetting resin composition containing said copolymer |
| JPH0425846A (en) | 1990-05-21 | 1992-01-29 | Hitachi Chem Co Ltd | Photosensitive resin composition |
| JP3363211B2 (en) * | 1993-08-06 | 2003-01-08 | 東京応化工業株式会社 | Photosensitive resin composition and method for producing the same |
| JP3939269B2 (en) | 1993-09-10 | 2007-07-04 | 関西ペイント株式会社 | Self-crosslinking resin |
| JP4347923B2 (en) * | 1998-04-27 | 2009-10-21 | 共栄社化学株式会社 | New carboxyl group-containing epoxy (meth) acrylate oligomer |
| JP4207604B2 (en) * | 2003-03-03 | 2009-01-14 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming them |
| JP4492393B2 (en) | 2005-03-08 | 2010-06-30 | チッソ株式会社 | Photosensitive composition and display element using the same |
| JP2014010200A (en) * | 2012-06-28 | 2014-01-20 | Fujifilm Corp | Photosensitive resin composition, production method of cured film, cured film, organic electroluminescence (el) display device, and liquid crystal display device |
| JP6157193B2 (en) | 2013-04-22 | 2017-07-05 | 昭和電工株式会社 | (Meth) acrylate polymer, composition containing the polymer and use thereof |
| JP2017057305A (en) * | 2015-09-17 | 2017-03-23 | 株式会社日本触媒 | Manufacturing method of double bond-containing resin |
| JP6644406B2 (en) * | 2015-09-29 | 2020-02-12 | 株式会社日本触媒 | Alkali-soluble resin and photosensitive resin composition |
| JP6807791B2 (en) * | 2017-03-23 | 2021-01-06 | 株式会社日本触媒 | Alkali-soluble resin, photosensitive resin composition and its uses |
| JP7216480B2 (en) | 2018-03-29 | 2023-02-01 | 太陽インキ製造株式会社 | Photocurable thermosetting resin composition, dry film, cured product, and printed wiring board |
| WO2021039799A1 (en) * | 2019-08-27 | 2021-03-04 | 株式会社日本触媒 | Curable composition |
-
2021
- 2021-08-02 WO PCT/JP2021/028611 patent/WO2022030445A1/en active Application Filing
- 2021-08-02 CN CN202180058721.6A patent/CN116057088A/en active Pending
- 2021-08-02 JP JP2022541534A patent/JP7415014B2/en active Active
- 2021-08-02 KR KR1020227044795A patent/KR20230015406A/en unknown
- 2021-08-03 TW TW110128526A patent/TW202216812A/en unknown
-
2023
- 2023-12-28 JP JP2023222707A patent/JP2024038213A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7415014B2 (en) | 2024-01-16 |
| TW202216812A (en) | 2022-05-01 |
| WO2022030445A1 (en) | 2022-02-10 |
| CN116057088A (en) | 2023-05-02 |
| KR20230015406A (en) | 2023-01-31 |
| JP2024038213A (en) | 2024-03-19 |
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