JPWO2022024756A1 - - Google Patents

Info

Publication number
JPWO2022024756A1
JPWO2022024756A1 JP2022540151A JP2022540151A JPWO2022024756A1 JP WO2022024756 A1 JPWO2022024756 A1 JP WO2022024756A1 JP 2022540151 A JP2022540151 A JP 2022540151A JP 2022540151 A JP2022540151 A JP 2022540151A JP WO2022024756 A1 JPWO2022024756 A1 JP WO2022024756A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022540151A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022024756A1 publication Critical patent/JPWO2022024756A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
JP2022540151A 2020-07-29 2021-07-14 Pending JPWO2022024756A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020128012 2020-07-29
PCT/JP2021/026405 WO2022024756A1 (ja) 2020-07-29 2021-07-14 光電気混載基板

Publications (1)

Publication Number Publication Date
JPWO2022024756A1 true JPWO2022024756A1 (ja) 2022-02-03

Family

ID=80036299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022540151A Pending JPWO2022024756A1 (ja) 2020-07-29 2021-07-14

Country Status (5)

Country Link
US (1) US20230258893A1 (ja)
JP (1) JPWO2022024756A1 (ja)
CN (1) CN115868252A (ja)
TW (1) TW202208905A (ja)
WO (1) WO2022024756A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771568A (en) * 1995-03-02 1998-06-30 Hutchinson Technology Incorporated Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance
JP2010266598A (ja) * 2009-05-13 2010-11-25 Hitachi Cable Ltd 光配線部材
JP5604840B2 (ja) * 2009-09-29 2014-10-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
JP6653857B2 (ja) * 2014-11-25 2020-02-26 日東電工株式会社 光電気混載基板およびその製法
JP6859136B2 (ja) * 2017-03-03 2021-04-14 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
JP7351610B2 (ja) * 2018-10-30 2023-09-27 浜松ホトニクス株式会社 光検出装置

Also Published As

Publication number Publication date
WO2022024756A1 (ja) 2022-02-03
US20230258893A1 (en) 2023-08-17
CN115868252A (zh) 2023-03-28
TW202208905A (zh) 2022-03-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20230113

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240521