JPWO2022024714A1 - - Google Patents

Info

Publication number
JPWO2022024714A1
JPWO2022024714A1 JP2022540127A JP2022540127A JPWO2022024714A1 JP WO2022024714 A1 JPWO2022024714 A1 JP WO2022024714A1 JP 2022540127 A JP2022540127 A JP 2022540127A JP 2022540127 A JP2022540127 A JP 2022540127A JP WO2022024714 A1 JPWO2022024714 A1 JP WO2022024714A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022540127A
Other languages
Japanese (ja)
Other versions
JP7469474B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022024714A1 publication Critical patent/JPWO2022024714A1/ja
Application granted granted Critical
Publication of JP7469474B2 publication Critical patent/JP7469474B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/34—Derivatives of acids of phosphorus
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/08—Liquid soap, e.g. for dispensers; capsuled
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022540127A 2020-07-30 2021-07-09 半導体基板用洗浄液 Active JP7469474B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020129663 2020-07-30
JP2020129663 2020-07-30
PCT/JP2021/025893 WO2022024714A1 (fr) 2020-07-30 2021-07-09 Solution de nettoyage de substrat semi-conducteur

Publications (2)

Publication Number Publication Date
JPWO2022024714A1 true JPWO2022024714A1 (fr) 2022-02-03
JP7469474B2 JP7469474B2 (ja) 2024-04-16

Family

ID=80036305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022540127A Active JP7469474B2 (ja) 2020-07-30 2021-07-09 半導体基板用洗浄液

Country Status (3)

Country Link
JP (1) JP7469474B2 (fr)
TW (1) TW202204589A (fr)
WO (1) WO2022024714A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023182142A1 (fr) * 2022-03-25 2023-09-28 富士フイルム株式会社 Composition, procédé de fabrication d'élément semi-conducteur et procédé de lavage de substrat semi-conducteur
JP7145351B1 (ja) * 2022-03-25 2022-09-30 富士フイルム株式会社 組成物、半導体素子の製造方法
WO2023210579A1 (fr) * 2022-04-26 2023-11-02 富士フイルム株式会社 Procédé de formation de motif et procédé de production de dispositif électronique
WO2024190141A1 (fr) * 2023-03-15 2024-09-19 富士フイルム株式会社 Liquide de traitement, procédé de nettoyage d'objet à traiter et procédé de production de dispositif électronique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041494A (ja) * 2004-06-25 2006-02-09 Jsr Corp 半導体部品洗浄用組成物および半導体装置の製造方法
WO2018020878A1 (fr) * 2016-07-26 2018-02-01 株式会社フジミインコーポレーテッド Composition de traitement de surface et procédé de traitement de surface utilisant ladite composition de traitement de surface

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041494A (ja) * 2004-06-25 2006-02-09 Jsr Corp 半導体部品洗浄用組成物および半導体装置の製造方法
WO2018020878A1 (fr) * 2016-07-26 2018-02-01 株式会社フジミインコーポレーテッド Composition de traitement de surface et procédé de traitement de surface utilisant ladite composition de traitement de surface

Also Published As

Publication number Publication date
WO2022024714A1 (fr) 2022-02-03
JP7469474B2 (ja) 2024-04-16
TW202204589A (zh) 2022-02-01

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