JPWO2022024714A1 - - Google Patents
Info
- Publication number
- JPWO2022024714A1 JPWO2022024714A1 JP2022540127A JP2022540127A JPWO2022024714A1 JP WO2022024714 A1 JPWO2022024714 A1 JP WO2022024714A1 JP 2022540127 A JP2022540127 A JP 2022540127A JP 2022540127 A JP2022540127 A JP 2022540127A JP WO2022024714 A1 JPWO2022024714 A1 JP WO2022024714A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/34—Derivatives of acids of phosphorus
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
- C11D17/08—Liquid soap, e.g. for dispensers; capsuled
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020129663 | 2020-07-30 | ||
JP2020129663 | 2020-07-30 | ||
PCT/JP2021/025893 WO2022024714A1 (fr) | 2020-07-30 | 2021-07-09 | Solution de nettoyage de substrat semi-conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022024714A1 true JPWO2022024714A1 (fr) | 2022-02-03 |
JP7469474B2 JP7469474B2 (ja) | 2024-04-16 |
Family
ID=80036305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022540127A Active JP7469474B2 (ja) | 2020-07-30 | 2021-07-09 | 半導体基板用洗浄液 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7469474B2 (fr) |
TW (1) | TW202204589A (fr) |
WO (1) | WO2022024714A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023182142A1 (fr) * | 2022-03-25 | 2023-09-28 | 富士フイルム株式会社 | Composition, procédé de fabrication d'élément semi-conducteur et procédé de lavage de substrat semi-conducteur |
JP7145351B1 (ja) * | 2022-03-25 | 2022-09-30 | 富士フイルム株式会社 | 組成物、半導体素子の製造方法 |
WO2023210579A1 (fr) * | 2022-04-26 | 2023-11-02 | 富士フイルム株式会社 | Procédé de formation de motif et procédé de production de dispositif électronique |
WO2024190141A1 (fr) * | 2023-03-15 | 2024-09-19 | 富士フイルム株式会社 | Liquide de traitement, procédé de nettoyage d'objet à traiter et procédé de production de dispositif électronique |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006041494A (ja) * | 2004-06-25 | 2006-02-09 | Jsr Corp | 半導体部品洗浄用組成物および半導体装置の製造方法 |
WO2018020878A1 (fr) * | 2016-07-26 | 2018-02-01 | 株式会社フジミインコーポレーテッド | Composition de traitement de surface et procédé de traitement de surface utilisant ladite composition de traitement de surface |
-
2021
- 2021-07-09 JP JP2022540127A patent/JP7469474B2/ja active Active
- 2021-07-09 WO PCT/JP2021/025893 patent/WO2022024714A1/fr active Application Filing
- 2021-07-23 TW TW110127197A patent/TW202204589A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006041494A (ja) * | 2004-06-25 | 2006-02-09 | Jsr Corp | 半導体部品洗浄用組成物および半導体装置の製造方法 |
WO2018020878A1 (fr) * | 2016-07-26 | 2018-02-01 | 株式会社フジミインコーポレーテッド | Composition de traitement de surface et procédé de traitement de surface utilisant ladite composition de traitement de surface |
Also Published As
Publication number | Publication date |
---|---|
WO2022024714A1 (fr) | 2022-02-03 |
JP7469474B2 (ja) | 2024-04-16 |
TW202204589A (zh) | 2022-02-01 |
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