JPWO2022019046A1 - - Google Patents
Info
- Publication number
- JPWO2022019046A1 JPWO2022019046A1 JP2022538654A JP2022538654A JPWO2022019046A1 JP WO2022019046 A1 JPWO2022019046 A1 JP WO2022019046A1 JP 2022538654 A JP2022538654 A JP 2022538654A JP 2022538654 A JP2022538654 A JP 2022538654A JP WO2022019046 A1 JPWO2022019046 A1 JP WO2022019046A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Materials For Photolithography (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020123768 | 2020-07-20 | ||
| PCT/JP2021/024156 WO2022019046A1 (en) | 2020-07-20 | 2021-06-25 | Photosensitive element, resist pattern forming method, and method for manufacturing printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022019046A1 true JPWO2022019046A1 (en) | 2022-01-27 |
Family
ID=79729437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022538654A Pending JPWO2022019046A1 (en) | 2020-07-20 | 2021-06-25 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022019046A1 (en) |
| KR (1) | KR20230041976A (en) |
| CN (1) | CN115867864A (en) |
| TW (1) | TW202206944A (en) |
| WO (1) | WO2022019046A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY189073A (en) * | 2015-07-08 | 2022-01-24 | Hitachi Chemical Co Ltd | Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board |
| WO2019215848A1 (en) | 2018-05-09 | 2019-11-14 | 日立化成株式会社 | Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method |
| WO2020054075A1 (en) * | 2018-09-14 | 2020-03-19 | 日立化成株式会社 | Transfer-type photosensitive film, method for forming resin cured film, and method for producing sensor substrate with resin cured film |
| CN113056373A (en) * | 2018-11-20 | 2021-06-29 | 富士胶片株式会社 | Transfer material, method for manufacturing resin pattern, method for manufacturing circuit wiring, and method for manufacturing touch panel |
-
2021
- 2021-06-25 JP JP2022538654A patent/JPWO2022019046A1/ja active Pending
- 2021-06-25 KR KR1020227045886A patent/KR20230041976A/en unknown
- 2021-06-25 CN CN202180047105.0A patent/CN115867864A/en active Pending
- 2021-06-25 WO PCT/JP2021/024156 patent/WO2022019046A1/en active Application Filing
- 2021-07-06 TW TW110124706A patent/TW202206944A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230041976A (en) | 2023-03-27 |
| TW202206944A (en) | 2022-02-16 |
| WO2022019046A1 (en) | 2022-01-27 |
| CN115867864A (en) | 2023-03-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240425 |