JPWO2022014259A1 - - Google Patents

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Publication number
JPWO2022014259A1
JPWO2022014259A1 JP2022536192A JP2022536192A JPWO2022014259A1 JP WO2022014259 A1 JPWO2022014259 A1 JP WO2022014259A1 JP 2022536192 A JP2022536192 A JP 2022536192A JP 2022536192 A JP2022536192 A JP 2022536192A JP WO2022014259 A1 JPWO2022014259 A1 JP WO2022014259A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022536192A
Other versions
JP7501636B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014259A1 publication Critical patent/JPWO2022014259A1/ja
Application granted granted Critical
Publication of JP7501636B2 publication Critical patent/JP7501636B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022536192A 2020-07-17 2021-06-18 半導体材料用樹脂組成物 Active JP7501636B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020122832 2020-07-17
JP2020122832 2020-07-17
PCT/JP2021/023232 WO2022014259A1 (ja) 2020-07-17 2021-06-18 半導体材料用樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022014259A1 true JPWO2022014259A1 (ja) 2022-01-20
JP7501636B2 JP7501636B2 (ja) 2024-06-18

Family

ID=79555220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536192A Active JP7501636B2 (ja) 2020-07-17 2021-06-18 半導体材料用樹脂組成物

Country Status (3)

Country Link
JP (1) JP7501636B2 (ja)
TW (1) TWI834978B (ja)
WO (1) WO2022014259A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0472360A (ja) * 1990-07-11 1992-03-06 Sumitomo Chem Co Ltd 半導体封止用熱硬化性樹脂組成物
JPH11246742A (ja) * 1998-02-27 1999-09-14 Hitachi Chem Co Ltd ペースト組成物及びこれを用いた半導体装置
EP1114845B1 (en) * 1998-08-21 2004-07-28 Hitachi Chemical Company, Ltd. Paste composition, and protective film and semiconductor device both obtained with the same
MY131961A (en) 2000-03-06 2007-09-28 Hitachi Chemical Co Ltd Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
JP2010195879A (ja) 2009-02-24 2010-09-09 Nitto Denko Corp カーボンブラック分散液およびこれを用いた半導電性ポリイミドベルトの製造方法
EP2997103B1 (en) * 2013-05-15 2019-03-06 Basf Se Use of chemical-mechanical polishing compositions comprising n,n,n',n'-tetrakis-(2-hydroxypropyl)-ethylenediamine and process
JP6816426B2 (ja) * 2016-09-23 2021-01-20 昭和電工マテリアルズ株式会社 アンダーフィル材及びそれを用いた電子部品装置
TWI663203B (zh) * 2017-02-14 2019-06-21 日商京瓷股份有限公司 樹脂片及半導體裝置、以及半導體裝置之製造方法

Also Published As

Publication number Publication date
JP7501636B2 (ja) 2024-06-18
WO2022014259A1 (ja) 2022-01-20
TW202205563A (zh) 2022-02-01
TWI834978B (zh) 2024-03-11

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