JPWO2022009486A1 - - Google Patents
Info
- Publication number
- JPWO2022009486A1 JPWO2022009486A1 JP2021536802A JP2021536802A JPWO2022009486A1 JP WO2022009486 A1 JPWO2022009486 A1 JP WO2022009486A1 JP 2021536802 A JP2021536802 A JP 2021536802A JP 2021536802 A JP2021536802 A JP 2021536802A JP WO2022009486 A1 JPWO2022009486 A1 JP WO2022009486A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020117285 | 2020-07-07 | ||
| JP2020117285 | 2020-07-07 | ||
| PCT/JP2021/012921 WO2022009486A1 (en) | 2020-07-07 | 2021-03-26 | Thermally conductive silicone gel composition and thermally conductive silicone gel sheet and method for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6942907B1 JP6942907B1 (en) | 2021-09-29 |
| JPWO2022009486A1 true JPWO2022009486A1 (en) | 2022-01-13 |
Family
ID=77847084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021536802A Active JP6942907B1 (en) | 2020-07-07 | 2021-03-26 | Thermally conductive silicone gel composition, thermally conductive silicone gel sheet and its manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20220380653A1 (en) |
| EP (1) | EP4039750A4 (en) |
| JP (1) | JP6942907B1 (en) |
| CN (1) | CN114729192B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115362547A (en) * | 2020-09-03 | 2022-11-18 | 富士高分子工业株式会社 | Heat-conducting organic silicon heat dissipation material |
| CN115044209B (en) * | 2022-05-31 | 2023-07-18 | 未来穿戴健康科技股份有限公司 | Heat conduction silica gel for eye massager, preparation method of heat conduction silica gel and eye massager |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3280224B2 (en) * | 1996-02-06 | 2002-04-30 | 東レ・ダウコーニング・シリコーン株式会社 | Thermal conductive silicone gel sheet and method for producing the same |
| JP3558527B2 (en) * | 1998-07-06 | 2004-08-25 | 信越化学工業株式会社 | Silicone gel sheet, composition and method for producing the same |
| JP4255287B2 (en) * | 2001-05-14 | 2009-04-15 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition |
| JP4828146B2 (en) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone rubber composition |
| JP2009203373A (en) * | 2008-02-28 | 2009-09-10 | Momentive Performance Materials Inc | Thermoconductive silicone composition |
| JP5418298B2 (en) * | 2010-02-26 | 2014-02-19 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| JP5664563B2 (en) * | 2012-01-23 | 2015-02-04 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| CN104136569A (en) * | 2012-03-02 | 2014-11-05 | 富士高分子工业株式会社 | Putty-like heat transfer material and method for producing same |
| JP5783128B2 (en) * | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | Heat curing type heat conductive silicone grease composition |
| JP2014208728A (en) * | 2013-04-16 | 2014-11-06 | 富士高分子工業株式会社 | Heat storable silicone material and method for producing the same |
| JP5843368B2 (en) * | 2013-05-07 | 2016-01-13 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| KR102348372B1 (en) * | 2014-04-09 | 2022-01-11 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | Thermally conductive silicone composition and electrical/electronic apparatus |
| JP6202475B2 (en) * | 2014-06-27 | 2017-09-27 | 信越化学工業株式会社 | Thermally conductive composite silicone rubber sheet |
| JP6194861B2 (en) * | 2014-07-28 | 2017-09-13 | 信越化学工業株式会社 | Thermally conductive silicone composition and thermally conductive silicone molding |
| JP6217588B2 (en) * | 2014-10-23 | 2017-10-25 | 信越化学工業株式会社 | Thermally conductive silicone potting composition |
| JP6314915B2 (en) * | 2015-06-12 | 2018-04-25 | 信越化学工業株式会社 | Heat dissipation putty sheet |
| JP6791815B2 (en) * | 2017-07-18 | 2020-11-25 | 信越化学工業株式会社 | Thermally conductive silicone resin composition |
| JP7160508B2 (en) * | 2017-07-24 | 2022-10-25 | ダウ・東レ株式会社 | Thermally conductive silicone gel composition, thermally conductive member, and heat dissipation structure |
| EP3712211A4 (en) * | 2017-11-17 | 2021-07-21 | Fuji Polymer Industries Co., Ltd. | Two-step curable thermally conductive silicone composition and method for producing same |
| JP6915599B2 (en) * | 2018-09-07 | 2021-08-04 | 信越化学工業株式会社 | Thermally conductive silicone composition |
| JP6933198B2 (en) * | 2018-10-17 | 2021-09-08 | 信越化学工業株式会社 | Thermally conductive silicone composition and its manufacturing method |
| CN112041411B (en) * | 2018-12-25 | 2022-04-01 | 富士高分子工业株式会社 | Thermally conductive composition and thermally conductive sheet using same |
| CN109880583B (en) * | 2019-01-10 | 2021-06-22 | 北京康美特科技股份有限公司 | Heat-conducting organic silicon adhesive, cured product thereof and LED element |
| JP6705067B1 (en) * | 2019-03-07 | 2020-06-03 | 富士高分子工業株式会社 | Thermally conductive sheet and manufacturing method thereof |
-
2021
- 2021-03-26 JP JP2021536802A patent/JP6942907B1/en active Active
- 2021-03-26 US US17/772,073 patent/US20220380653A1/en active Pending
- 2021-03-26 CN CN202180006611.5A patent/CN114729192B/en active Active
- 2021-03-26 EP EP21837839.6A patent/EP4039750A4/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN114729192A (en) | 2022-07-08 |
| US20220380653A1 (en) | 2022-12-01 |
| EP4039750A1 (en) | 2022-08-10 |
| JP6942907B1 (en) | 2021-09-29 |
| CN114729192B (en) | 2024-04-26 |
| EP4039750A4 (en) | 2023-01-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210623 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210706 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20210706 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210907 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210908 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6942907 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |