JPWO2022009298A1 - - Google Patents
Info
- Publication number
- JPWO2022009298A1 JPWO2022009298A1 JP2022534525A JP2022534525A JPWO2022009298A1 JP WO2022009298 A1 JPWO2022009298 A1 JP WO2022009298A1 JP 2022534525 A JP2022534525 A JP 2022534525A JP 2022534525 A JP2022534525 A JP 2022534525A JP WO2022009298 A1 JPWO2022009298 A1 JP WO2022009298A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/026517 WO2022009298A1 (ja) | 2020-07-07 | 2020-07-07 | 電子部品装着機及び電子部品装着機の制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022009298A1 true JPWO2022009298A1 (ja) | 2022-01-13 |
JP7403654B2 JP7403654B2 (ja) | 2023-12-22 |
Family
ID=79552300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022534525A Active JP7403654B2 (ja) | 2020-07-07 | 2020-07-07 | 電子部品装着機及び電子部品装着機の制御方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7403654B2 (ja) |
CN (1) | CN115669251A (ja) |
DE (1) | DE112020007391T5 (ja) |
WO (1) | WO2022009298A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234669A (ja) * | 2006-02-27 | 2007-09-13 | Juki Corp | 表面実装装置 |
JP2015032725A (ja) * | 2013-08-05 | 2015-02-16 | パナソニックIpマネジメント株式会社 | 部品実装方法および部品実装装置 |
WO2018163384A1 (ja) * | 2017-03-09 | 2018-09-13 | 株式会社Fuji | 供給部品検査装置 |
WO2019058562A1 (ja) * | 2017-09-25 | 2019-03-28 | 株式会社Fuji | テープフィーダ |
WO2019229958A1 (ja) * | 2018-05-31 | 2019-12-05 | 株式会社Fuji | フィーダおよび部品実装機 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5641889B2 (ja) | 1973-09-12 | 1981-10-01 |
-
2020
- 2020-07-07 WO PCT/JP2020/026517 patent/WO2022009298A1/ja active Application Filing
- 2020-07-07 JP JP2022534525A patent/JP7403654B2/ja active Active
- 2020-07-07 CN CN202080101509.9A patent/CN115669251A/zh active Pending
- 2020-07-07 DE DE112020007391.2T patent/DE112020007391T5/de active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234669A (ja) * | 2006-02-27 | 2007-09-13 | Juki Corp | 表面実装装置 |
JP2015032725A (ja) * | 2013-08-05 | 2015-02-16 | パナソニックIpマネジメント株式会社 | 部品実装方法および部品実装装置 |
WO2018163384A1 (ja) * | 2017-03-09 | 2018-09-13 | 株式会社Fuji | 供給部品検査装置 |
WO2019058562A1 (ja) * | 2017-09-25 | 2019-03-28 | 株式会社Fuji | テープフィーダ |
WO2019229958A1 (ja) * | 2018-05-31 | 2019-12-05 | 株式会社Fuji | フィーダおよび部品実装機 |
Also Published As
Publication number | Publication date |
---|---|
WO2022009298A1 (ja) | 2022-01-13 |
CN115669251A (zh) | 2023-01-31 |
DE112020007391T5 (de) | 2023-04-20 |
JP7403654B2 (ja) | 2023-12-22 |
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