JPWO2022009298A1 - - Google Patents

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Publication number
JPWO2022009298A1
JPWO2022009298A1 JP2022534525A JP2022534525A JPWO2022009298A1 JP WO2022009298 A1 JPWO2022009298 A1 JP WO2022009298A1 JP 2022534525 A JP2022534525 A JP 2022534525A JP 2022534525 A JP2022534525 A JP 2022534525A JP WO2022009298 A1 JPWO2022009298 A1 JP WO2022009298A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022534525A
Other versions
JP7403654B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022009298A1 publication Critical patent/JPWO2022009298A1/ja
Application granted granted Critical
Publication of JP7403654B2 publication Critical patent/JP7403654B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/082Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022534525A 2020-07-07 2020-07-07 電子部品装着機及び電子部品装着機の制御方法 Active JP7403654B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/026517 WO2022009298A1 (ja) 2020-07-07 2020-07-07 電子部品装着機及び電子部品装着機の制御方法

Publications (2)

Publication Number Publication Date
JPWO2022009298A1 true JPWO2022009298A1 (ja) 2022-01-13
JP7403654B2 JP7403654B2 (ja) 2023-12-22

Family

ID=79552300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534525A Active JP7403654B2 (ja) 2020-07-07 2020-07-07 電子部品装着機及び電子部品装着機の制御方法

Country Status (4)

Country Link
JP (1) JP7403654B2 (ja)
CN (1) CN115669251A (ja)
DE (1) DE112020007391T5 (ja)
WO (1) WO2022009298A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234669A (ja) * 2006-02-27 2007-09-13 Juki Corp 表面実装装置
JP2015032725A (ja) * 2013-08-05 2015-02-16 パナソニックIpマネジメント株式会社 部品実装方法および部品実装装置
WO2018163384A1 (ja) * 2017-03-09 2018-09-13 株式会社Fuji 供給部品検査装置
WO2019058562A1 (ja) * 2017-09-25 2019-03-28 株式会社Fuji テープフィーダ
WO2019229958A1 (ja) * 2018-05-31 2019-12-05 株式会社Fuji フィーダおよび部品実装機

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5641889B2 (ja) 1973-09-12 1981-10-01

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234669A (ja) * 2006-02-27 2007-09-13 Juki Corp 表面実装装置
JP2015032725A (ja) * 2013-08-05 2015-02-16 パナソニックIpマネジメント株式会社 部品実装方法および部品実装装置
WO2018163384A1 (ja) * 2017-03-09 2018-09-13 株式会社Fuji 供給部品検査装置
WO2019058562A1 (ja) * 2017-09-25 2019-03-28 株式会社Fuji テープフィーダ
WO2019229958A1 (ja) * 2018-05-31 2019-12-05 株式会社Fuji フィーダおよび部品実装機

Also Published As

Publication number Publication date
WO2022009298A1 (ja) 2022-01-13
CN115669251A (zh) 2023-01-31
DE112020007391T5 (de) 2023-04-20
JP7403654B2 (ja) 2023-12-22

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