JPWO2022004235A1 - - Google Patents
Info
- Publication number
- JPWO2022004235A1 JPWO2022004235A1 JP2022533758A JP2022533758A JPWO2022004235A1 JP WO2022004235 A1 JPWO2022004235 A1 JP WO2022004235A1 JP 2022533758 A JP2022533758 A JP 2022533758A JP 2022533758 A JP2022533758 A JP 2022533758A JP WO2022004235 A1 JPWO2022004235 A1 JP WO2022004235A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020112469 | 2020-06-30 | ||
PCT/JP2021/020683 WO2022004235A1 (ja) | 2020-06-30 | 2021-05-31 | 熱可塑性樹脂組成物、部材及びその製造方法、並びに熱可塑性樹脂組成物の導電性発現方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022004235A1 true JPWO2022004235A1 (xx) | 2022-01-06 |
Family
ID=79315966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022533758A Pending JPWO2022004235A1 (xx) | 2020-06-30 | 2021-05-31 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022004235A1 (xx) |
CN (1) | CN115885017A (xx) |
WO (1) | WO2022004235A1 (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7217384B2 (ja) * | 2020-10-09 | 2023-02-02 | ポリプラスチックス株式会社 | ポリアセタール樹脂組成物及び自動車部品 |
CN116783245A (zh) * | 2020-12-23 | 2023-09-19 | 宝理塑料株式会社 | 聚缩醛树脂组合物以及燃料接触体 |
WO2024053535A1 (ja) * | 2022-09-08 | 2024-03-14 | Dic株式会社 | 導電性樹脂組成物、マスターバッチ、成形体及びそれらの製造方法 |
WO2024083686A1 (en) * | 2022-10-17 | 2024-04-25 | Dsm Ip Assets B.V. | Electrically conductive polymer composition, process for preparation and moulding, and articles made thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5591382A (en) * | 1993-03-31 | 1997-01-07 | Hyperion Catalysis International Inc. | High strength conductive polymers |
JP2007112885A (ja) * | 2005-10-19 | 2007-05-10 | Bussan Nanotech Research Institute Inc | 熱可塑性エラストマー組成物 |
JP2007119647A (ja) * | 2005-10-28 | 2007-05-17 | Bussan Nanotech Research Institute Inc | 複合材料 |
KR100706651B1 (ko) * | 2006-12-22 | 2007-04-13 | 제일모직주식회사 | 전기 전도성 열가소성 수지 조성물 및 플라스틱 성형품 |
JP5596336B2 (ja) * | 2009-12-24 | 2014-09-24 | ポリプラスチックス株式会社 | ポリアセタール樹脂組成物の製造方法 |
JP2012140482A (ja) * | 2010-12-28 | 2012-07-26 | Hodogaya Chem Co Ltd | ポリアセタール樹脂/カーボンナノチューブ導電性樹脂複合材料 |
JP5616943B2 (ja) * | 2012-02-21 | 2014-10-29 | 大日精化工業株式会社 | 導電性樹脂組成物の製造方法及び導電性樹脂組成物 |
JP5489184B2 (ja) * | 2012-04-18 | 2014-05-14 | テックワン株式会社 | 分岐型炭素繊維、分岐型炭素繊維製造方法、前記分岐型炭素繊維を有する材 |
KR101654405B1 (ko) * | 2013-12-06 | 2016-09-05 | 주식회사 엘지화학 | 기계적 물성이 개선된 복합재 및 이를 함유하는 성형품 |
EP3591010B1 (en) * | 2017-02-28 | 2023-12-20 | Mitsui Chemicals, Inc. | Electroconductive resin composition, method for manufacturing same and molded article obtained therefrom |
WO2019181828A1 (ja) * | 2018-03-20 | 2019-09-26 | 大日精化工業株式会社 | 導電性樹脂組成物及びその製造方法 |
-
2021
- 2021-05-31 CN CN202180046675.8A patent/CN115885017A/zh active Pending
- 2021-05-31 WO PCT/JP2021/020683 patent/WO2022004235A1/ja active Application Filing
- 2021-05-31 JP JP2022533758A patent/JPWO2022004235A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN115885017A (zh) | 2023-03-31 |
WO2022004235A1 (ja) | 2022-01-06 |
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