JPWO2021261154A1 - - Google Patents

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Publication number
JPWO2021261154A1
JPWO2021261154A1 JP2022532433A JP2022532433A JPWO2021261154A1 JP WO2021261154 A1 JPWO2021261154 A1 JP WO2021261154A1 JP 2022532433 A JP2022532433 A JP 2022532433A JP 2022532433 A JP2022532433 A JP 2022532433A JP WO2021261154 A1 JPWO2021261154 A1 JP WO2021261154A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022532433A
Other languages
Japanese (ja)
Other versions
JP7457807B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021261154A1 publication Critical patent/JPWO2021261154A1/ja
Application granted granted Critical
Publication of JP7457807B2 publication Critical patent/JP7457807B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2022532433A 2020-06-25 2021-05-25 圧電素子 Active JP7457807B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020109721 2020-06-25
JP2020109721 2020-06-25
PCT/JP2021/019822 WO2021261154A1 (ja) 2020-06-25 2021-05-25 圧電素子

Publications (2)

Publication Number Publication Date
JPWO2021261154A1 true JPWO2021261154A1 (zh) 2021-12-30
JP7457807B2 JP7457807B2 (ja) 2024-03-28

Family

ID=79282437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532433A Active JP7457807B2 (ja) 2020-06-25 2021-05-25 圧電素子

Country Status (7)

Country Link
US (1) US20230127642A1 (zh)
EP (1) EP4175322A4 (zh)
JP (1) JP7457807B2 (zh)
KR (1) KR20230010710A (zh)
CN (1) CN115700063A (zh)
TW (1) TW202205705A (zh)
WO (1) WO2021261154A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021095511A1 (ja) 2019-11-12 2021-05-20 富士フイルム株式会社 圧電素子
US20230160762A1 (en) * 2021-11-25 2023-05-25 National Taiwan University Of Science And Technology Pressure Sensing Element with Porous Structure Based Flexible Base

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
CN101467206B (zh) * 2006-06-22 2011-09-21 大日本印刷株式会社 悬架用基板及其制造方法
JP5599858B2 (ja) 2011-09-30 2014-10-01 富士フイルム株式会社 電気音響変換フィルム、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
JP6005093B2 (ja) 2013-03-28 2016-10-12 富士フイルム株式会社 電気音響変換フィルム、電気音響変換器、フレキシブルディスプレイおよびプロジェクター用スクリーン
JP6005089B2 (ja) * 2013-03-29 2016-10-12 富士フイルム株式会社 電気音響変換フィルム
JP6071932B2 (ja) 2013-04-01 2017-02-01 富士フイルム株式会社 電気音響変換フィルム
JP6304593B2 (ja) 2014-05-21 2018-04-04 株式会社リコー 電気機械変換部材、液滴吐出ヘッド、画像形成装置、及び、電気機械変換素子の分極処理方法
JP6199245B2 (ja) * 2014-06-30 2017-09-20 富士フイルム株式会社 電気音響変換フィルムおよび電気音響変換フィルムの導通方法
JP6870925B2 (ja) 2015-08-24 2021-05-12 ローム株式会社 圧電素子利用装置およびその製造方法
US10870009B2 (en) * 2017-01-04 2020-12-22 Cardiac Pacemakers, Inc. Buzzer apparatus
EP3879590A4 (en) 2018-11-08 2021-12-29 FUJIFILM Corporation Laminated piezoelectric element and electro-acoustic transducer
WO2021095511A1 (ja) * 2019-11-12 2021-05-20 富士フイルム株式会社 圧電素子

Also Published As

Publication number Publication date
KR20230010710A (ko) 2023-01-19
TW202205705A (zh) 2022-02-01
US20230127642A1 (en) 2023-04-27
JP7457807B2 (ja) 2024-03-28
EP4175322A1 (en) 2023-05-03
CN115700063A (zh) 2023-02-03
WO2021261154A1 (ja) 2021-12-30
EP4175322A4 (en) 2023-12-06

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