JPWO2021255811A1 - - Google Patents

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Publication number
JPWO2021255811A1
JPWO2021255811A1 JP2022530657A JP2022530657A JPWO2021255811A1 JP WO2021255811 A1 JPWO2021255811 A1 JP WO2021255811A1 JP 2022530657 A JP2022530657 A JP 2022530657A JP 2022530657 A JP2022530657 A JP 2022530657A JP WO2021255811 A1 JPWO2021255811 A1 JP WO2021255811A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022530657A
Other languages
Japanese (ja)
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JP7138822B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2021255811A1 publication Critical patent/JPWO2021255811A1/ja
Application granted granted Critical
Publication of JP7138822B2 publication Critical patent/JP7138822B2/en
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Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022530657A 2020-06-16 2020-06-16 Electromagnetic coupling controller Active JP7138822B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023495 WO2021255811A1 (en) 2020-06-16 2020-06-16 Electromagnetic coupling control device

Publications (2)

Publication Number Publication Date
JPWO2021255811A1 true JPWO2021255811A1 (en) 2021-12-23
JP7138822B2 JP7138822B2 (en) 2022-09-16

Family

ID=79268681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022530657A Active JP7138822B2 (en) 2020-06-16 2020-06-16 Electromagnetic coupling controller

Country Status (2)

Country Link
JP (1) JP7138822B2 (en)
WO (1) WO2021255811A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100127790A1 (en) * 2008-11-26 2010-05-27 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
JP2011109414A (en) * 2009-11-17 2011-06-02 Toshiba Tec Corp Periodic structure
WO2011070736A1 (en) * 2009-12-08 2011-06-16 日本電気株式会社 Noise-suppressing tape
WO2011111297A1 (en) * 2010-03-08 2011-09-15 日本電気株式会社 Structure, wiring substrate, and method for producing wiring substrate
JP2014175438A (en) * 2013-03-08 2014-09-22 Nec Corp Wiring board and electronic apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100127790A1 (en) * 2008-11-26 2010-05-27 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
JP2011109414A (en) * 2009-11-17 2011-06-02 Toshiba Tec Corp Periodic structure
WO2011070736A1 (en) * 2009-12-08 2011-06-16 日本電気株式会社 Noise-suppressing tape
WO2011111297A1 (en) * 2010-03-08 2011-09-15 日本電気株式会社 Structure, wiring substrate, and method for producing wiring substrate
JP2014175438A (en) * 2013-03-08 2014-09-22 Nec Corp Wiring board and electronic apparatus

Also Published As

Publication number Publication date
WO2021255811A1 (en) 2021-12-23
JP7138822B2 (en) 2022-09-16

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