JPWO2021246445A5

JPWO2021246445A5 -

Info

Publication number: JPWO2021246445A5
Application number: JP2022528868A
Authority: JP
Filing date: 2021-06-02
Publication date: 2023-03-13

Claims

an acrylic resin (A) having a plurality of phenolic hydroxyl groups, at least a portion of the plurality of phenolic hydroxyl groups being protected with an acid-decomposable group;
At least one black colorant (B) selected from the group consisting of black dyes and black pigments;
A positive photosensitive resin composition containing a quinonediazide compound (C) as a photoacid generator.

The acrylic resin (A) is represented by formula (3)

In formula (3), R ¹ is an alkyl group having 1 to 5 carbon atoms, R ⁵ is the acid-decomposable group, and r is an integer of 0 to 5 s is an integer of 0 to 5, provided that r + s is an integer of 1 to 5, and the acrylic resin (A) has at least one structural unit in which s is an integer of 1 or more. 2. The positive photosensitive resin composition according to 1.

The acrylic resin (A) has the formula (2)

In formula (2), R ² and R ³ are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, completely or partially a fluorinated alkyl group having 1 to 3 carbon atoms or a halogen atom, and R ⁴ is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms or a cyclic alkyl group having 4 to 12 carbon atoms, or hydroxy The positive group according to claim 2, which is a phenyl group optionally substituted with at least one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 6 carbon atoms. type photosensitive resin composition.

4. The positive photosensitive resin composition according to claim 2, wherein the acrylic resin (A) contains 60 mol % to 100 mol % of the structural unit represented by formula (3).

The positive photosensitive resin composition according to any one of claims 1 to 4, comprising 20 parts by mass to 50 parts by mass of the quinonediazide compound (C) based on a total of 100 parts by mass of the resin components.

The content of the photoacid generator other than the quinonediazide compound (C) is 0.5 parts by mass or less based on the total 100 parts by mass of the resin components, according to any one of claims 1 to 5. A positive photosensitive resin composition.

The acid-decomposable group of the acrylic resin (A) is a trimethylsilyl group, a triethylsilyl group, a t-butyldimethylsilyl group, a triisopropylsilyl group, a t-butyldiphenylsilyl group, and formula (6).
—CR ⁶ R ⁷ —OR ⁸ (6)
wherein R ⁶ and R ⁷ are each independently a hydrogen atom, or a straight or branched chain having 1 to 4 carbon atoms R ⁸ is a linear, branched or cyclic alkyl group having 1 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or an alkenyl group having 2 to 12 carbon atoms. and one of R ⁶ or R ⁷ and R ⁸ may combine to form a ring structure having 3 to 10 ring members, and R ⁶ , R ⁷ and R ⁸ are fluorine, chlorine, bromine and iodine The positive photosensitive resin composition according to any one of claims 1 to 6, which may be substituted with a halogen atom selected from the group consisting of.

8. The positive photosensitive resin composition according to any one of claims 1 to 7, wherein 10 mol% to 95 mol% of the phenolic hydroxyl groups of the acrylic resin (A) are protected with the acid-decomposable groups. .

The positive photosensitive resin composition according to any one of claims 1 to 8, comprising 30% by mass to 90% by mass of the acrylic resin (A) based on the total mass of the resin components.

The positive photosensitive resin composition according to any one of claims 1 to 9, comprising 10 parts by mass to 150 parts by mass of the black colorant (B) based on a total of 100 parts by mass of the resin components.

The positive photosensitive resin composition according to any one of claims 1 to 10, wherein the cured film of the positive photosensitive resin composition has an optical density (OD value) of 0.5 or more per 1 µm of film thickness. .

The positive photosensitive resin composition according to any one of claims 1 to 11, further comprising a resin (D) having an epoxy group and a phenolic hydroxyl group.

The resin (D) having an epoxy group and a phenolic hydroxyl group is a reaction product of a compound having at least two epoxy groups in one molecule and a hydroxybenzoic acid compound, and

In formula (5), b is an integer of 1 to 5, * is the residue of a compound having at least two epoxy groups in one molecule, excluding the epoxy group involved in the reaction 13. The positive photosensitive resin composition according to claim 12, which represents a bond with a group.

14. The positive photosensitive resin composition according to claim 13, wherein the compound having at least two epoxy groups in one molecule is a novolac epoxy resin.

15. The positive photosensitive resin composition according to claim 13, wherein said hydroxybenzoic acid compound is a dihydroxybenzoic acid compound.

An organic EL element partition comprising a cured product of the positive photosensitive resin composition according to any one of claims 1 to 15.

An organic EL element insulating film comprising a cured product of the positive photosensitive resin composition according to any one of claims 1 to 15.

An organic EL device comprising a cured product of the positive photosensitive resin composition according to any one of claims 1 to 15.