JPWO2021245907A1 - - Google Patents

Info

Publication number
JPWO2021245907A1
JPWO2021245907A1 JP2022528369A JP2022528369A JPWO2021245907A1 JP WO2021245907 A1 JPWO2021245907 A1 JP WO2021245907A1 JP 2022528369 A JP2022528369 A JP 2022528369A JP 2022528369 A JP2022528369 A JP 2022528369A JP WO2021245907 A1 JPWO2021245907 A1 JP WO2021245907A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022528369A
Other languages
Japanese (ja)
Other versions
JP7372576B2 (ja
JPWO2021245907A5 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021245907A1 publication Critical patent/JPWO2021245907A1/ja
Publication of JPWO2021245907A5 publication Critical patent/JPWO2021245907A5/ja
Application granted granted Critical
Publication of JP7372576B2 publication Critical patent/JP7372576B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2022528369A 2020-06-05 2020-06-05 光電子集積モジュール Active JP7372576B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022253 WO2021245907A1 (ja) 2020-06-05 2020-06-05 光電子集積モジュール

Publications (3)

Publication Number Publication Date
JPWO2021245907A1 true JPWO2021245907A1 (cg-RX-API-DMAC7.html) 2021-12-09
JPWO2021245907A5 JPWO2021245907A5 (cg-RX-API-DMAC7.html) 2022-12-02
JP7372576B2 JP7372576B2 (ja) 2023-11-01

Family

ID=78830744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528369A Active JP7372576B2 (ja) 2020-06-05 2020-06-05 光電子集積モジュール

Country Status (3)

Country Link
US (1) US12332489B2 (cg-RX-API-DMAC7.html)
JP (1) JP7372576B2 (cg-RX-API-DMAC7.html)
WO (1) WO2021245907A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114899182A (zh) * 2022-04-25 2022-08-12 深圳市思坦科技有限公司 微型led器件的封装结构及方法以及显示装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116344629B (zh) * 2023-02-24 2025-09-30 深南电路股份有限公司 一种基于玻璃波导的光电混合器件及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073651A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置
JP2009164564A (ja) * 2007-12-14 2009-07-23 Denso Corp 電子装置およびその製造方法
JP2012114334A (ja) * 2010-11-26 2012-06-14 Nec Casio Mobile Communications Ltd キャビティ基板を備える半導体モジュール、その不良解析方法、及び該半導体モジュールの製造方法
WO2014020787A1 (ja) * 2012-08-03 2014-02-06 パナソニック株式会社 電子部品モジュールとその実装体
JP2015029043A (ja) * 2013-06-26 2015-02-12 京セラ株式会社 電子装置および光モジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8111730B2 (en) * 2009-08-20 2012-02-07 International Business Machines Corporation 3D optoelectronic packaging
US9543226B1 (en) * 2015-10-07 2017-01-10 Coriant Advanced Technology, LLC Heat sink for a semiconductor chip device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073651A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置
JP2009164564A (ja) * 2007-12-14 2009-07-23 Denso Corp 電子装置およびその製造方法
JP2012114334A (ja) * 2010-11-26 2012-06-14 Nec Casio Mobile Communications Ltd キャビティ基板を備える半導体モジュール、その不良解析方法、及び該半導体モジュールの製造方法
WO2014020787A1 (ja) * 2012-08-03 2014-02-06 パナソニック株式会社 電子部品モジュールとその実装体
JP2015029043A (ja) * 2013-06-26 2015-02-12 京セラ株式会社 電子装置および光モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114899182A (zh) * 2022-04-25 2022-08-12 深圳市思坦科技有限公司 微型led器件的封装结构及方法以及显示装置

Also Published As

Publication number Publication date
JP7372576B2 (ja) 2023-11-01
US20230244045A1 (en) 2023-08-03
WO2021245907A1 (ja) 2021-12-09
US12332489B2 (en) 2025-06-17

Similar Documents

Publication Publication Date Title
CN306480942S (zh) 卡片（捷创qms方法含fema、spc）
CN306490360S (zh) 雨伞
CN306005608S (zh) 紫外线杀菌灯
CN306010706S (zh) 电梯曳引机（k1600a）
CN306175967S (zh) 多功能行车记录仪（带etc功能）
CN305861473S (zh) 玩具（卡通动物3）
CN306002522S (zh) 包装盒（麻虾酱）
CN305994095S (zh) 紫砂壶（凤舞龙翔）
CN306008736S (zh) 酒杯
CN305892089S (zh) 饼干沙发
CN305995566S (zh) 数字传感器
CN305993882S (zh) 相框条（4339-1011）
CN306004216S (zh) 数据存储装置
CN305994222S (zh) 勺子
CN305881291S (zh) 宠物发球机
CN305892714S (zh) 鞋柜门板（巴洛克）
CN305884151S (zh) 衣钩底座（59）
CN305799027S (zh) 搭扣（5543abc）
CN305799316S (zh) 塑料压力空气气瓶（6）
CN305852244S (zh) 地板清洁机夹具
CN305730742S (zh) 茶台（yc-19-ct-669）
CN305742025S (zh) 净味盒盖
CN305722205S (zh) 家具快速制作连接器
CN305729350S (zh) 猫宿舍(325)
CN305733389S (zh) 工艺品（纽约城市风景摆饰水球）

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220926

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221109

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230919

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231002

R150 Certificate of patent or registration of utility model

Ref document number: 7372576

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350