JPWO2021241387A1 - - Google Patents

Info

Publication number
JPWO2021241387A1
JPWO2021241387A1 JP2022526949A JP2022526949A JPWO2021241387A1 JP WO2021241387 A1 JPWO2021241387 A1 JP WO2021241387A1 JP 2022526949 A JP2022526949 A JP 2022526949A JP 2022526949 A JP2022526949 A JP 2022526949A JP WO2021241387 A1 JPWO2021241387 A1 JP WO2021241387A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022526949A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021241387A1 publication Critical patent/JPWO2021241387A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2022526949A 2020-05-27 2021-05-20 Pending JPWO2021241387A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020092345 2020-05-27
PCT/JP2021/019133 WO2021241387A1 (ja) 2020-05-27 2021-05-20 レーザ溶接方法及びレーザ溶接装置

Publications (1)

Publication Number Publication Date
JPWO2021241387A1 true JPWO2021241387A1 (de) 2021-12-02

Family

ID=78744454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022526949A Pending JPWO2021241387A1 (de) 2020-05-27 2021-05-20

Country Status (3)

Country Link
JP (1) JPWO2021241387A1 (de)
CN (1) CN115151369A (de)
WO (1) WO2021241387A1 (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238077B2 (ja) * 1996-08-28 2001-12-10 新日本製鐵株式会社 めっき鋼板の重ねレーザ溶接方法
JP5239366B2 (ja) * 2008-02-05 2013-07-17 日産自動車株式会社 レーザ溶接方法、レーザ溶接装置、および溶接部材
DE102012008940B4 (de) * 2012-05-08 2022-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Fügen von mindestens zwei Werkstücken
BR112021000911A2 (pt) * 2018-07-19 2021-04-13 Ipg Photonics Corporation Sistemas e métodos para monitorar e/ou controlar processamento de oscilação utilizando formação de imagem coerente em linha (ici)

Also Published As

Publication number Publication date
CN115151369A (zh) 2022-10-04
WO2021241387A1 (ja) 2021-12-02

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Legal Events

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Effective date: 20221024

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Effective date: 20231115