JPWO2021230096A1 - - Google Patents
Info
- Publication number
- JPWO2021230096A1 JPWO2021230096A1 JP2022521834A JP2022521834A JPWO2021230096A1 JP WO2021230096 A1 JPWO2021230096 A1 JP WO2021230096A1 JP 2022521834 A JP2022521834 A JP 2022521834A JP 2022521834 A JP2022521834 A JP 2022521834A JP WO2021230096 A1 JPWO2021230096 A1 JP WO2021230096A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020085923 | 2020-05-15 | ||
| JP2020118922 | 2020-07-10 | ||
| PCT/JP2021/017134 WO2021230096A1 (ja) | 2020-05-15 | 2021-04-30 | 変性窒化ホウ素粒子の製造方法、変性窒化ホウ素粒子、熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021230096A1 true JPWO2021230096A1 (zh) | 2021-11-18 |
Family
ID=78525737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022521834A Pending JPWO2021230096A1 (zh) | 2020-05-15 | 2021-04-30 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021230096A1 (zh) |
| TW (1) | TW202202441A (zh) |
| WO (1) | WO2021230096A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115651338B (zh) * | 2022-10-17 | 2023-06-23 | 扬州大学 | 一种丙烯酸基纳米复合材料的制备方法 |
| CN117603555B (zh) * | 2024-01-24 | 2024-03-22 | 四川大学 | 一种高导热高韧性环氧树脂复合材料及其制备方法与应用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5722016B2 (ja) * | 2010-12-07 | 2015-05-20 | 国立大学法人東北大学 | 窒化ホウ素粉末の表面処理方法 |
| KR102360935B1 (ko) * | 2016-10-21 | 2022-02-09 | 덴카 주식회사 | 구형상 질화 붕소 미분말, 그 제조 방법 및 이를 이용한 열전도 수지 조성물 |
| CN107903441B (zh) * | 2017-11-14 | 2019-07-12 | 四川大学 | 一种提高聚合物击穿强度和储能密度的方法 |
| KR102105364B1 (ko) * | 2018-12-06 | 2020-04-29 | 한국기초과학지원연구원 | 친수성 표면 개질된 질화붕소의 제조방법 및 방열성 조성물 |
-
2021
- 2021-04-30 WO PCT/JP2021/017134 patent/WO2021230096A1/ja active Application Filing
- 2021-04-30 JP JP2022521834A patent/JPWO2021230096A1/ja active Pending
- 2021-05-12 TW TW110117141A patent/TW202202441A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202202441A (zh) | 2022-01-16 |
| WO2021230096A1 (ja) | 2021-11-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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| A621 | Written request for application examination |
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| A131 | Notification of reasons for refusal |
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| A131 | Notification of reasons for refusal |
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| A521 | Request for written amendment filed |
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