JPWO2021225162A1 - - Google Patents
Info
- Publication number
- JPWO2021225162A1 JPWO2021225162A1 JP2022519633A JP2022519633A JPWO2021225162A1 JP WO2021225162 A1 JPWO2021225162 A1 JP WO2021225162A1 JP 2022519633 A JP2022519633 A JP 2022519633A JP 2022519633 A JP2022519633 A JP 2022519633A JP WO2021225162 A1 JPWO2021225162 A1 JP WO2021225162A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020081803 | 2020-05-07 | ||
PCT/JP2021/017507 WO2021225162A1 (en) | 2020-05-07 | 2021-05-07 | Transfer film, method for producing laminate, touch sensor, and method for producing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021225162A1 true JPWO2021225162A1 (en) | 2021-11-11 |
Family
ID=78467981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022519633A Pending JPWO2021225162A1 (en) | 2020-05-07 | 2021-05-07 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021225162A1 (en) |
CN (1) | CN115516376A (en) |
WO (1) | WO2021225162A1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006053390A (en) * | 2004-08-12 | 2006-02-23 | Fuji Photo Film Co Ltd | Production line of photosensitive film |
JP2013238837A (en) * | 2011-11-21 | 2013-11-28 | Toyo Ink Sc Holdings Co Ltd | Photosensitive dry film, and protective film and touch-panel insulating film using the same |
JP2015175961A (en) * | 2014-03-14 | 2015-10-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel |
WO2016072202A1 (en) * | 2014-11-07 | 2016-05-12 | Dic株式会社 | Curable composition, resist material and resist film |
JP2019031597A (en) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | Resin composition, cured film, semiconductor device and method for manufacturing semiconductor device |
JP2019121740A (en) * | 2018-01-10 | 2019-07-22 | 住友電気工業株式会社 | Method for manufacturing printed wiring board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019151534A1 (en) * | 2018-02-05 | 2019-08-08 | 富士フイルム株式会社 | Photosensitive transfer material, manufacturing method for circuit wiring, and manufacturing method for touch panel |
-
2021
- 2021-05-07 WO PCT/JP2021/017507 patent/WO2021225162A1/en active Application Filing
- 2021-05-07 CN CN202180033218.5A patent/CN115516376A/en active Pending
- 2021-05-07 JP JP2022519633A patent/JPWO2021225162A1/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006053390A (en) * | 2004-08-12 | 2006-02-23 | Fuji Photo Film Co Ltd | Production line of photosensitive film |
JP2013238837A (en) * | 2011-11-21 | 2013-11-28 | Toyo Ink Sc Holdings Co Ltd | Photosensitive dry film, and protective film and touch-panel insulating film using the same |
JP2015175961A (en) * | 2014-03-14 | 2015-10-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel |
WO2016072202A1 (en) * | 2014-11-07 | 2016-05-12 | Dic株式会社 | Curable composition, resist material and resist film |
JP2019031597A (en) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | Resin composition, cured film, semiconductor device and method for manufacturing semiconductor device |
JP2019121740A (en) * | 2018-01-10 | 2019-07-22 | 住友電気工業株式会社 | Method for manufacturing printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
WO2021225162A1 (en) | 2021-11-11 |
CN115516376A (en) | 2022-12-23 |
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