JPWO2022044831A1 - - Google Patents

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Publication number
JPWO2022044831A1
JPWO2022044831A1 JP2022544447A JP2022544447A JPWO2022044831A1 JP WO2022044831 A1 JPWO2022044831 A1 JP WO2022044831A1 JP 2022544447 A JP2022544447 A JP 2022544447A JP 2022544447 A JP2022544447 A JP 2022544447A JP WO2022044831 A1 JPWO2022044831 A1 JP WO2022044831A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022544447A
Other languages
Japanese (ja)
Other versions
JP7479482B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022044831A1 publication Critical patent/JPWO2022044831A1/ja
Application granted granted Critical
Publication of JP7479482B2 publication Critical patent/JP7479482B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2022544447A 2020-08-25 2021-08-12 Photosensitive transfer material, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method Active JP7479482B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020141774 2020-08-25
JP2020141774 2020-08-25
PCT/JP2021/029748 WO2022044831A1 (en) 2020-08-25 2021-08-12 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel

Publications (2)

Publication Number Publication Date
JPWO2022044831A1 true JPWO2022044831A1 (en) 2022-03-03
JP7479482B2 JP7479482B2 (en) 2024-05-08

Family

ID=80352250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544447A Active JP7479482B2 (en) 2020-08-25 2021-08-12 Photosensitive transfer material, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method

Country Status (3)

Country Link
JP (1) JP7479482B2 (en)
CN (1) CN116097171A (en)
WO (1) WO2022044831A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204070A (en) * 2018-02-05 2019-11-28 富士フイルム株式会社 Photosensitive transfer material, manufacturing method for circuit wiring, and manufacturing method for touch panel

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005148236A (en) * 2003-11-12 2005-06-09 Fuji Photo Film Co Ltd Dry film photoresist
JP2006003436A (en) * 2004-06-15 2006-01-05 Fuji Photo Film Co Ltd Pattern forming material, pattern forming apparatus, and pattern forming method
CN102844709B (en) * 2010-04-15 2014-08-20 日合墨东株式会社 Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board
JP2016099374A (en) * 2014-11-18 2016-05-30 日立化成株式会社 Photosensitive element, method for manufacturing substrate with resist pattern, method for manufacturing printed wiring board, and method for manufacturing touch panel
WO2020203502A1 (en) * 2019-04-05 2020-10-08 富士フイルム株式会社 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring line, and method for producing touch panel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204070A (en) * 2018-02-05 2019-11-28 富士フイルム株式会社 Photosensitive transfer material, manufacturing method for circuit wiring, and manufacturing method for touch panel

Also Published As

Publication number Publication date
JP7479482B2 (en) 2024-05-08
WO2022044831A1 (en) 2022-03-03
CN116097171A (en) 2023-05-09

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