JPWO2021220865A1 - - Google Patents

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Publication number
JPWO2021220865A1
JPWO2021220865A1 JP2022517646A JP2022517646A JPWO2021220865A1 JP WO2021220865 A1 JPWO2021220865 A1 JP WO2021220865A1 JP 2022517646 A JP2022517646 A JP 2022517646A JP 2022517646 A JP2022517646 A JP 2022517646A JP WO2021220865 A1 JPWO2021220865 A1 JP WO2021220865A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022517646A
Other versions
JP7345642B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220865A1 publication Critical patent/JPWO2021220865A1/ja
Application granted granted Critical
Publication of JP7345642B2 publication Critical patent/JP7345642B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022517646A 2020-05-01 2021-04-19 基板処理装置のカップの洗浄方法、及び基板処理装置 Active JP7345642B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081376 2020-05-01
JP2020081376 2020-05-01
PCT/JP2021/015879 WO2021220865A1 (ja) 2020-05-01 2021-04-19 基板処理装置のカップの洗浄方法、及び基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2021220865A1 true JPWO2021220865A1 (ja) 2021-11-04
JP7345642B2 JP7345642B2 (ja) 2023-09-15

Family

ID=78374096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022517646A Active JP7345642B2 (ja) 2020-05-01 2021-04-19 基板処理装置のカップの洗浄方法、及び基板処理装置

Country Status (6)

Country Link
US (1) US20230187199A1 (ja)
JP (1) JP7345642B2 (ja)
KR (1) KR20230005183A (ja)
CN (1) CN115485812A (ja)
TW (1) TW202205413A (ja)
WO (1) WO2021220865A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11238713A (ja) * 1998-02-20 1999-08-31 Tokyo Electron Ltd 洗浄装置
JP2007324548A (ja) * 2006-06-05 2007-12-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2013004845A (ja) * 2011-06-20 2013-01-07 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2015070073A (ja) * 2013-09-27 2015-04-13 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP2017120887A (ja) * 2015-12-28 2017-07-06 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2017163017A (ja) * 2016-03-10 2017-09-14 株式会社荏原製作所 基板処理装置
JP2019033157A (ja) * 2017-08-07 2019-02-28 東京エレクトロン株式会社 基板処理方法、記憶媒体および基板処理装置
JP2019145734A (ja) * 2018-02-23 2019-08-29 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015176996A (ja) 2014-03-14 2015-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11238713A (ja) * 1998-02-20 1999-08-31 Tokyo Electron Ltd 洗浄装置
JP2007324548A (ja) * 2006-06-05 2007-12-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2013004845A (ja) * 2011-06-20 2013-01-07 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2015070073A (ja) * 2013-09-27 2015-04-13 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP2017120887A (ja) * 2015-12-28 2017-07-06 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2017163017A (ja) * 2016-03-10 2017-09-14 株式会社荏原製作所 基板処理装置
JP2019033157A (ja) * 2017-08-07 2019-02-28 東京エレクトロン株式会社 基板処理方法、記憶媒体および基板処理装置
JP2019145734A (ja) * 2018-02-23 2019-08-29 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Also Published As

Publication number Publication date
JP7345642B2 (ja) 2023-09-15
US20230187199A1 (en) 2023-06-15
WO2021220865A1 (ja) 2021-11-04
KR20230005183A (ko) 2023-01-09
CN115485812A (zh) 2022-12-16
TW202205413A (zh) 2022-02-01

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