JPWO2021210187A1 - - Google Patents

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Publication number
JPWO2021210187A1
JPWO2021210187A1 JP2022515185A JP2022515185A JPWO2021210187A1 JP WO2021210187 A1 JPWO2021210187 A1 JP WO2021210187A1 JP 2022515185 A JP2022515185 A JP 2022515185A JP 2022515185 A JP2022515185 A JP 2022515185A JP WO2021210187 A1 JPWO2021210187 A1 JP WO2021210187A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022515185A
Other versions
JP7270107B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021210187A1 publication Critical patent/JPWO2021210187A1/ja
Application granted granted Critical
Publication of JP7270107B2 publication Critical patent/JP7270107B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022515185A 2020-04-18 2020-04-18 部品装着機 Active JP7270107B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/016980 WO2021210187A1 (ja) 2020-04-18 2020-04-18 部品装着機

Publications (2)

Publication Number Publication Date
JPWO2021210187A1 true JPWO2021210187A1 (ja) 2021-10-21
JP7270107B2 JP7270107B2 (ja) 2023-05-09

Family

ID=78084440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515185A Active JP7270107B2 (ja) 2020-04-18 2020-04-18 部品装着機

Country Status (2)

Country Link
JP (1) JP7270107B2 (ja)
WO (1) WO2021210187A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024089747A1 (ja) * 2022-10-24 2024-05-02 株式会社Fuji 装着機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001043523A1 (fr) * 1999-12-07 2001-06-14 Matsushita Electric Industrial Co., Ltd. Procede et dispositif pour le montage de pieces, et supports d'enregistrement
JP2005109119A (ja) * 2003-09-30 2005-04-21 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2008270320A (ja) * 2007-04-17 2008-11-06 Matsushita Electric Ind Co Ltd 部品実装装置の部品持ち帰り検査装置及び方法
WO2016194174A1 (ja) * 2015-06-03 2016-12-08 富士機械製造株式会社 部品装着機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001043523A1 (fr) * 1999-12-07 2001-06-14 Matsushita Electric Industrial Co., Ltd. Procede et dispositif pour le montage de pieces, et supports d'enregistrement
JP2005109119A (ja) * 2003-09-30 2005-04-21 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2008270320A (ja) * 2007-04-17 2008-11-06 Matsushita Electric Ind Co Ltd 部品実装装置の部品持ち帰り検査装置及び方法
WO2016194174A1 (ja) * 2015-06-03 2016-12-08 富士機械製造株式会社 部品装着機

Also Published As

Publication number Publication date
WO2021210187A1 (ja) 2021-10-21
JP7270107B2 (ja) 2023-05-09

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