JPWO2021210187A1 - - Google Patents
Info
- Publication number
- JPWO2021210187A1 JPWO2021210187A1 JP2022515185A JP2022515185A JPWO2021210187A1 JP WO2021210187 A1 JPWO2021210187 A1 JP WO2021210187A1 JP 2022515185 A JP2022515185 A JP 2022515185A JP 2022515185 A JP2022515185 A JP 2022515185A JP WO2021210187 A1 JPWO2021210187 A1 JP WO2021210187A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/016980 WO2021210187A1 (ja) | 2020-04-18 | 2020-04-18 | 部品装着機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021210187A1 true JPWO2021210187A1 (ja) | 2021-10-21 |
JP7270107B2 JP7270107B2 (ja) | 2023-05-09 |
Family
ID=78084440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022515185A Active JP7270107B2 (ja) | 2020-04-18 | 2020-04-18 | 部品装着機 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7270107B2 (ja) |
WO (1) | WO2021210187A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024089747A1 (ja) * | 2022-10-24 | 2024-05-02 | 株式会社Fuji | 装着機 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001043523A1 (fr) * | 1999-12-07 | 2001-06-14 | Matsushita Electric Industrial Co., Ltd. | Procede et dispositif pour le montage de pieces, et supports d'enregistrement |
JP2005109119A (ja) * | 2003-09-30 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2008270320A (ja) * | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 部品実装装置の部品持ち帰り検査装置及び方法 |
WO2016194174A1 (ja) * | 2015-06-03 | 2016-12-08 | 富士機械製造株式会社 | 部品装着機 |
-
2020
- 2020-04-18 JP JP2022515185A patent/JP7270107B2/ja active Active
- 2020-04-18 WO PCT/JP2020/016980 patent/WO2021210187A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001043523A1 (fr) * | 1999-12-07 | 2001-06-14 | Matsushita Electric Industrial Co., Ltd. | Procede et dispositif pour le montage de pieces, et supports d'enregistrement |
JP2005109119A (ja) * | 2003-09-30 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2008270320A (ja) * | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 部品実装装置の部品持ち帰り検査装置及び方法 |
WO2016194174A1 (ja) * | 2015-06-03 | 2016-12-08 | 富士機械製造株式会社 | 部品装着機 |
Also Published As
Publication number | Publication date |
---|---|
WO2021210187A1 (ja) | 2021-10-21 |
JP7270107B2 (ja) | 2023-05-09 |
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