JPWO2021205980A1 - - Google Patents

Info

Publication number
JPWO2021205980A1
JPWO2021205980A1 JP2022514442A JP2022514442A JPWO2021205980A1 JP WO2021205980 A1 JPWO2021205980 A1 JP WO2021205980A1 JP 2022514442 A JP2022514442 A JP 2022514442A JP 2022514442 A JP2022514442 A JP 2022514442A JP WO2021205980 A1 JPWO2021205980 A1 JP WO2021205980A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022514442A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021205980A1 publication Critical patent/JPWO2021205980A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
JP2022514442A 2020-04-08 2021-04-01 Pending JPWO2021205980A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020070039 2020-04-08
PCT/JP2021/014166 WO2021205980A1 (en) 2020-04-08 2021-04-01 Mounting system, mounting method, and program

Publications (1)

Publication Number Publication Date
JPWO2021205980A1 true JPWO2021205980A1 (en) 2021-10-14

Family

ID=78024104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514442A Pending JPWO2021205980A1 (en) 2020-04-08 2021-04-01

Country Status (2)

Country Link
JP (1) JPWO2021205980A1 (en)
WO (1) WO2021205980A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117813930A (en) * 2022-02-25 2024-04-02 松下知识产权经营株式会社 Mounting system and mounting method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633147B2 (en) * 1992-07-23 1997-07-23 松下電工株式会社 Component mounting method
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board

Also Published As

Publication number Publication date
WO2021205980A1 (en) 2021-10-14

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240205