JPWO2021205578A1 - - Google Patents

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Publication number
JPWO2021205578A1
JPWO2021205578A1 JP2022513778A JP2022513778A JPWO2021205578A1 JP WO2021205578 A1 JPWO2021205578 A1 JP WO2021205578A1 JP 2022513778 A JP2022513778 A JP 2022513778A JP 2022513778 A JP2022513778 A JP 2022513778A JP WO2021205578 A1 JPWO2021205578 A1 JP WO2021205578A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022513778A
Other languages
Japanese (ja)
Other versions
JP7298017B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021205578A1 publication Critical patent/JPWO2021205578A1/ja
Application granted granted Critical
Publication of JP7298017B2 publication Critical patent/JP7298017B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022513778A 2020-04-08 2020-04-08 Image processing device, mounting device, and image processing method Active JP7298017B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/015873 WO2021205578A1 (en) 2020-04-08 2020-04-08 Image processing device, mounting device, and image processing method

Publications (2)

Publication Number Publication Date
JPWO2021205578A1 true JPWO2021205578A1 (en) 2021-10-14
JP7298017B2 JP7298017B2 (en) 2023-06-26

Family

ID=78023605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022513778A Active JP7298017B2 (en) 2020-04-08 2020-04-08 Image processing device, mounting device, and image processing method

Country Status (5)

Country Link
US (1) US20230217636A1 (en)
EP (1) EP4135503A4 (en)
JP (1) JP7298017B2 (en)
CN (1) CN115211245A (en)
WO (1) WO2021205578A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023100247A1 (en) * 2021-11-30 2023-06-08 株式会社Fuji Inspection device and inspection method
WO2023195173A1 (en) * 2022-04-08 2023-10-12 株式会社Fuji Component mounting system and image classification method
WO2023248281A1 (en) * 2022-06-20 2023-12-28 株式会社Fuji Inspection device, mounting device, and inspection method
WO2024009410A1 (en) * 2022-07-05 2024-01-11 株式会社Fuji Component presence/absence determination method and image processing system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011044591A (en) * 2009-08-21 2011-03-03 Juki Corp Electronic component mounting device and suction position correction method therefor
JP2014072409A (en) * 2012-09-28 2014-04-21 Juki Corp Component inspection method and device
JP2016127217A (en) * 2015-01-08 2016-07-11 パナソニックＩｐマネジメント株式会社 Electronic component supply device and processing method for component supply tape in electronic component supply device
WO2016203628A1 (en) * 2015-06-18 2016-12-22 富士機械製造株式会社 Tape cutting processing device and processing method
JP2019036015A (en) * 2017-08-10 2019-03-07 ヤマハ発動機株式会社 Surface mounting machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903360B2 (en) * 2002-10-16 2005-06-07 Agilent Technologies, Inc. Method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
DE102004011327B3 (en) * 2004-03-09 2005-11-10 S-Y Systems Technologies Europe Gmbh Apparatus and method for determining if a component is missing.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011044591A (en) * 2009-08-21 2011-03-03 Juki Corp Electronic component mounting device and suction position correction method therefor
JP2014072409A (en) * 2012-09-28 2014-04-21 Juki Corp Component inspection method and device
JP2016127217A (en) * 2015-01-08 2016-07-11 パナソニックＩｐマネジメント株式会社 Electronic component supply device and processing method for component supply tape in electronic component supply device
WO2016203628A1 (en) * 2015-06-18 2016-12-22 富士機械製造株式会社 Tape cutting processing device and processing method
JP2019036015A (en) * 2017-08-10 2019-03-07 ヤマハ発動機株式会社 Surface mounting machine

Also Published As

Publication number Publication date
US20230217636A1 (en) 2023-07-06
CN115211245A (en) 2022-10-18
EP4135503A1 (en) 2023-02-15
JP7298017B2 (en) 2023-06-26
EP4135503A4 (en) 2023-06-07
WO2021205578A1 (en) 2021-10-14

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