JPWO2021200965A1 - - Google Patents

Info

Publication number
JPWO2021200965A1
JPWO2021200965A1 JP2022512548A JP2022512548A JPWO2021200965A1 JP WO2021200965 A1 JPWO2021200965 A1 JP WO2021200965A1 JP 2022512548 A JP2022512548 A JP 2022512548A JP 2022512548 A JP2022512548 A JP 2022512548A JP WO2021200965 A1 JPWO2021200965 A1 JP WO2021200965A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022512548A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021200965A1 publication Critical patent/JPWO2021200965A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B38/00Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/82Coating or impregnation with organic materials
    • C04B41/83Macromolecular compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022512548A 2020-03-31 2021-03-30 Pending JPWO2021200965A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020064233 2020-03-31
PCT/JP2021/013570 WO2021200965A1 (ja) 2020-03-31 2021-03-30 複合体シート

Publications (1)

Publication Number Publication Date
JPWO2021200965A1 true JPWO2021200965A1 (https=) 2021-10-07

Family

ID=77928657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512548A Pending JPWO2021200965A1 (https=) 2020-03-31 2021-03-30

Country Status (2)

Country Link
JP (1) JPWO2021200965A1 (https=)
WO (1) WO2021200965A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451827B2 (ja) * 2022-03-30 2024-03-18 デンカ株式会社 回路基板の製造方法及び回路基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014142123A1 (ja) * 2013-03-15 2014-09-18 三菱電機株式会社 熱伝導性絶縁シート、パワーモジュール及びその製造方法
WO2017155110A1 (ja) * 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
WO2019172345A1 (ja) * 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014142123A1 (ja) * 2013-03-15 2014-09-18 三菱電機株式会社 熱伝導性絶縁シート、パワーモジュール及びその製造方法
WO2017155110A1 (ja) * 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
WO2019172345A1 (ja) * 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法

Also Published As

Publication number Publication date
WO2021200965A1 (ja) 2021-10-07

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