JPWO2021200861A1 - - Google Patents

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Publication number
JPWO2021200861A1
JPWO2021200861A1 JP2022512235A JP2022512235A JPWO2021200861A1 JP WO2021200861 A1 JPWO2021200861 A1 JP WO2021200861A1 JP 2022512235 A JP2022512235 A JP 2022512235A JP 2022512235 A JP2022512235 A JP 2022512235A JP WO2021200861 A1 JPWO2021200861 A1 JP WO2021200861A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022512235A
Other versions
JP7420922B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021200861A1 publication Critical patent/JPWO2021200861A1/ja
Application granted granted Critical
Publication of JP7420922B2 publication Critical patent/JP7420922B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022512235A 2020-03-31 2021-03-29 接合基板 Active JP7420922B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020063065 2020-03-31
JP2020063065 2020-03-31
PCT/JP2021/013385 WO2021200861A1 (ja) 2020-03-31 2021-03-29 接合基板

Publications (2)

Publication Number Publication Date
JPWO2021200861A1 true JPWO2021200861A1 (ja) 2021-10-07
JP7420922B2 JP7420922B2 (ja) 2024-01-23

Family

ID=77930397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512235A Active JP7420922B2 (ja) 2020-03-31 2021-03-29 接合基板

Country Status (2)

Country Link
JP (1) JP7420922B2 (ja)
WO (1) WO2021200861A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139720A (ja) * 2016-02-02 2017-08-10 信越化学工業株式会社 複合基板および複合基板の製造方法
WO2019159555A1 (ja) * 2018-02-13 2019-08-22 日本碍子株式会社 圧電性材料基板と支持基板との接合体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112019001985B4 (de) 2018-05-17 2022-05-05 Ngk Insulators, Ltd. Verbundener Körper aus einem piezoelektrischen Einkristallsubstrat und einem Trägersubstrat
JP7152711B2 (ja) 2018-06-20 2022-10-13 日本電産マシンツール株式会社 接合基板の製造方法及び接合基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139720A (ja) * 2016-02-02 2017-08-10 信越化学工業株式会社 複合基板および複合基板の製造方法
WO2019159555A1 (ja) * 2018-02-13 2019-08-22 日本碍子株式会社 圧電性材料基板と支持基板との接合体

Also Published As

Publication number Publication date
JP7420922B2 (ja) 2024-01-23
WO2021200861A1 (ja) 2021-10-07

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