JPWO2021200861A1 - - Google Patents
Info
- Publication number
- JPWO2021200861A1 JPWO2021200861A1 JP2022512235A JP2022512235A JPWO2021200861A1 JP WO2021200861 A1 JPWO2021200861 A1 JP WO2021200861A1 JP 2022512235 A JP2022512235 A JP 2022512235A JP 2022512235 A JP2022512235 A JP 2022512235A JP WO2021200861 A1 JPWO2021200861 A1 JP WO2021200861A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020063065 | 2020-03-31 | ||
JP2020063065 | 2020-03-31 | ||
PCT/JP2021/013385 WO2021200861A1 (ja) | 2020-03-31 | 2021-03-29 | 接合基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021200861A1 true JPWO2021200861A1 (ja) | 2021-10-07 |
JP7420922B2 JP7420922B2 (ja) | 2024-01-23 |
Family
ID=77930397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022512235A Active JP7420922B2 (ja) | 2020-03-31 | 2021-03-29 | 接合基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7420922B2 (ja) |
WO (1) | WO2021200861A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017139720A (ja) * | 2016-02-02 | 2017-08-10 | 信越化学工業株式会社 | 複合基板および複合基板の製造方法 |
WO2019159555A1 (ja) * | 2018-02-13 | 2019-08-22 | 日本碍子株式会社 | 圧電性材料基板と支持基板との接合体 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112019001985B4 (de) | 2018-05-17 | 2022-05-05 | Ngk Insulators, Ltd. | Verbundener Körper aus einem piezoelektrischen Einkristallsubstrat und einem Trägersubstrat |
JP7152711B2 (ja) | 2018-06-20 | 2022-10-13 | 日本電産マシンツール株式会社 | 接合基板の製造方法及び接合基板 |
-
2021
- 2021-03-29 WO PCT/JP2021/013385 patent/WO2021200861A1/ja active Application Filing
- 2021-03-29 JP JP2022512235A patent/JP7420922B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017139720A (ja) * | 2016-02-02 | 2017-08-10 | 信越化学工業株式会社 | 複合基板および複合基板の製造方法 |
WO2019159555A1 (ja) * | 2018-02-13 | 2019-08-22 | 日本碍子株式会社 | 圧電性材料基板と支持基板との接合体 |
Also Published As
Publication number | Publication date |
---|---|
JP7420922B2 (ja) | 2024-01-23 |
WO2021200861A1 (ja) | 2021-10-07 |
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