JPWO2021200758A1 - - Google Patents

Info

Publication number
JPWO2021200758A1
JPWO2021200758A1 JP2022512167A JP2022512167A JPWO2021200758A1 JP WO2021200758 A1 JPWO2021200758 A1 JP WO2021200758A1 JP 2022512167 A JP2022512167 A JP 2022512167A JP 2022512167 A JP2022512167 A JP 2022512167A JP WO2021200758 A1 JPWO2021200758 A1 JP WO2021200758A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022512167A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021200758A1 publication Critical patent/JPWO2021200758A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
JP2022512167A 2020-03-30 2021-03-26 Pending JPWO2021200758A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020059987 2020-03-30
PCT/JP2021/013142 WO2021200758A1 (en) 2020-03-30 2021-03-26 Photocurable sheet adhesive

Publications (1)

Publication Number Publication Date
JPWO2021200758A1 true JPWO2021200758A1 (en) 2021-10-07

Family

ID=77927393

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022512167A Pending JPWO2021200758A1 (en) 2020-03-30 2021-03-26
JP2022512166A Pending JPWO2021200757A1 (en) 2020-03-30 2021-03-26

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022512166A Pending JPWO2021200757A1 (en) 2020-03-30 2021-03-26

Country Status (5)

Country Link
JP (2) JPWO2021200758A1 (en)
KR (2) KR20220161547A (en)
CN (2) CN115279854A (en)
TW (2) TW202140734A (en)
WO (2) WO2021200758A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116802220A (en) 2022-01-13 2023-09-22 古河电气工业株式会社 Resin composition for flexible device, film-like adhesive for flexible device, adhesive sheet for flexible device, and method for producing flexible device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002146319A (en) * 2000-11-13 2002-05-22 Three M Innovative Properties Co Thermosetting adhesive and adhesive film using the same
KR100827756B1 (en) * 2002-03-13 2008-05-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Thermosetting adhesive agent and adhesive film using the same
JP5448024B2 (en) * 2007-03-15 2014-03-19 住友化学株式会社 Photocurable adhesive, polarizing plate using the photocurable adhesive, method for producing the same, optical member, and liquid crystal display device
JP5465453B2 (en) * 2009-03-26 2014-04-09 パナソニック株式会社 Epoxy resin composition for forming optical waveguide, curable film for forming optical waveguide, flexible printed wiring board for optical transmission, and electronic information device
JP2010275373A (en) * 2009-05-26 2010-12-09 Toagosei Co Ltd Active energy ray-curable type composition for optical film or sheet and active energy ray-curable type adhesive film or sheet
EP2439246B1 (en) * 2009-06-01 2015-09-30 Nitto Denko Corporation Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet
JP5555532B2 (en) * 2010-04-22 2014-07-23 積水化学工業株式会社 Sealant for organic EL element and organic EL element
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
JP5948784B2 (en) 2011-10-13 2016-07-06 三菱レイヨン株式会社 Epoxy resin composition
KR20130055541A (en) * 2011-11-18 2013-05-28 주식회사 엘지화학 Photocuring type adhesive or pressure-sensitive adhesive film for encapsulating organic electronic device, organic electronic device and preparing method thereof
JP6306679B2 (en) * 2012-07-31 2018-04-04 日東電工株式会社 Radiation curable adhesive, radiation curable adhesive layer, radiation curable adhesive sheet and laminate
JP6067405B2 (en) * 2012-07-31 2017-01-25 日東電工株式会社 Radiation curable adhesive, radiation curable adhesive layer, radiation curable adhesive sheet and laminate
KR101832522B1 (en) * 2013-11-29 2018-04-04 주식회사 엘지화학 Composition for forming adhesive film, adhesive film before light curing for further processing, adhesive film and electronic paper display
JP2017110128A (en) 2015-12-17 2017-06-22 Dic株式会社 Thermosetting adhesive sheet, article and method for producing article
JP6690356B2 (en) * 2016-03-29 2020-04-28 味の素株式会社 Thermosetting resin composition
JP6353990B1 (en) * 2016-09-07 2018-07-04 リンテック株式会社 Adhesive composition, sealing sheet, and sealing body
KR102389948B1 (en) * 2016-11-18 2022-04-21 가부시끼가이샤 쓰리본드 Cationic Curable Adhesive Composition for Camera Module, Cured Product and Adhesive
JP2018168305A (en) * 2017-03-30 2018-11-01 リンテック株式会社 Adhesive sheet, laminate, and device
WO2020196240A1 (en) * 2019-03-28 2020-10-01 リンテック株式会社 Sheet-like adhesive agent, sealing sheet, electronic device sealed body, and method for manufacturing electronic device sealed body

Also Published As

Publication number Publication date
KR20220161547A (en) 2022-12-06
WO2021200757A1 (en) 2021-10-07
KR20220161545A (en) 2022-12-06
JPWO2021200757A1 (en) 2021-10-07
TW202140734A (en) 2021-11-01
CN115279854A (en) 2022-11-01
TW202142661A (en) 2021-11-16
WO2021200758A1 (en) 2021-10-07
CN115427526A (en) 2022-12-02

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Effective date: 20231228