JPWO2021200149A1 - - Google Patents
Info
- Publication number
- JPWO2021200149A1 JPWO2021200149A1 JP2022511841A JP2022511841A JPWO2021200149A1 JP WO2021200149 A1 JPWO2021200149 A1 JP WO2021200149A1 JP 2022511841 A JP2022511841 A JP 2022511841A JP 2022511841 A JP2022511841 A JP 2022511841A JP WO2021200149 A1 JPWO2021200149 A1 JP WO2021200149A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020060913 | 2020-03-30 | ||
PCT/JP2021/010796 WO2021200149A1 (ja) | 2020-03-30 | 2021-03-17 | 研磨用組成物および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021200149A1 true JPWO2021200149A1 (ja) | 2021-10-07 |
Family
ID=77927915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022511841A Pending JPWO2021200149A1 (ja) | 2020-03-30 | 2021-03-17 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021200149A1 (ja) |
TW (1) | TW202145332A (ja) |
WO (1) | WO2021200149A1 (ja) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3450247B2 (ja) * | 1999-12-28 | 2003-09-22 | Necエレクトロニクス株式会社 | 金属配線形成方法 |
US7485241B2 (en) * | 2003-09-11 | 2009-02-03 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
-
2021
- 2021-03-17 JP JP2022511841A patent/JPWO2021200149A1/ja active Pending
- 2021-03-17 WO PCT/JP2021/010796 patent/WO2021200149A1/ja active Application Filing
- 2021-03-29 TW TW110111281A patent/TW202145332A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2021200149A1 (ja) | 2021-10-07 |
TW202145332A (zh) | 2021-12-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240119 |