JPWO2021199996A1 - - Google Patents

Info

Publication number
JPWO2021199996A1
JPWO2021199996A1 JP2022511746A JP2022511746A JPWO2021199996A1 JP WO2021199996 A1 JPWO2021199996 A1 JP WO2021199996A1 JP 2022511746 A JP2022511746 A JP 2022511746A JP 2022511746 A JP2022511746 A JP 2022511746A JP WO2021199996 A1 JPWO2021199996 A1 JP WO2021199996A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022511746A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021199996A1 publication Critical patent/JPWO2021199996A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
JP2022511746A 2020-03-30 2021-03-10 Pending JPWO2021199996A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020061101 2020-03-30
JP2020172155 2020-10-12
JP2020207812 2020-12-15
PCT/JP2021/009634 WO2021199996A1 (en) 2020-03-30 2021-03-10 Photosensitive transfer material, method for manufacturing resin pattern, method for manufacturing circuit wiring, and temporary support body for photosensitive transfer material

Publications (1)

Publication Number Publication Date
JPWO2021199996A1 true JPWO2021199996A1 (en) 2021-10-07

Family

ID=77928685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511746A Pending JPWO2021199996A1 (en) 2020-03-30 2021-03-10

Country Status (3)

Country Link
JP (1) JPWO2021199996A1 (en)
CN (1) CN115398341A (en)
WO (1) WO2021199996A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120077A1 (en) * 2021-12-24 2023-06-29 東京応化工業株式会社 Composition, and photosensitive composition
WO2023120076A1 (en) * 2021-12-24 2023-06-29 東京応化工業株式会社 Photosensitive composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726846A (en) * 1980-05-27 1982-02-13 Du Pont Photosensitive layer
JP2004012610A (en) * 2002-06-04 2004-01-15 Toray Ind Inc Biaxially oriented polyester film for dry photoresist
WO2017208849A1 (en) * 2016-05-31 2017-12-07 富士フイルム株式会社 Photosensitive resin composition, transfer film, decorative pattern, touch panel and method for producing pattern
WO2019065373A1 (en) * 2017-09-29 2019-04-04 富士フイルム株式会社 Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel
JP2019191518A (en) * 2018-04-27 2019-10-31 富士フイルム株式会社 Photosensitive transfer material, production method of resist pattern and method for manufacturing circuit wiring

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726846A (en) * 1980-05-27 1982-02-13 Du Pont Photosensitive layer
JP2004012610A (en) * 2002-06-04 2004-01-15 Toray Ind Inc Biaxially oriented polyester film for dry photoresist
WO2017208849A1 (en) * 2016-05-31 2017-12-07 富士フイルム株式会社 Photosensitive resin composition, transfer film, decorative pattern, touch panel and method for producing pattern
WO2019065373A1 (en) * 2017-09-29 2019-04-04 富士フイルム株式会社 Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel
JP2019191518A (en) * 2018-04-27 2019-10-31 富士フイルム株式会社 Photosensitive transfer material, production method of resist pattern and method for manufacturing circuit wiring

Also Published As

Publication number Publication date
CN115398341A (en) 2022-11-25
WO2021199996A1 (en) 2021-10-07

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