JPWO2021192801A1 - - Google Patents

Info

Publication number
JPWO2021192801A1
JPWO2021192801A1 JP2022509437A JP2022509437A JPWO2021192801A1 JP WO2021192801 A1 JPWO2021192801 A1 JP WO2021192801A1 JP 2022509437 A JP2022509437 A JP 2022509437A JP 2022509437 A JP2022509437 A JP 2022509437A JP WO2021192801 A1 JPWO2021192801 A1 JP WO2021192801A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022509437A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021192801A1 publication Critical patent/JPWO2021192801A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
JP2022509437A 2020-03-24 2021-02-25 Pending JPWO2021192801A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020052662 2020-03-24
PCT/JP2021/007107 WO2021192801A1 (ja) 2020-03-24 2021-02-25 プロセスモニタ及びプロセスモニタ方法

Publications (1)

Publication Number Publication Date
JPWO2021192801A1 true JPWO2021192801A1 (ja) 2021-09-30

Family

ID=77891655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509437A Pending JPWO2021192801A1 (ja) 2020-03-24 2021-02-25

Country Status (6)

Country Link
US (1) US20230011199A1 (ja)
EP (1) EP4131340A4 (ja)
JP (1) JPWO2021192801A1 (ja)
KR (1) KR20220157995A (ja)
CN (1) CN115298802A (ja)
WO (1) WO2021192801A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131430A (ja) * 1983-12-19 1985-07-13 Dainippon Screen Mfg Co Ltd 半導体基板の温度測定装置
US5061084A (en) * 1988-04-27 1991-10-29 Ag Processing Technologies, Inc. Pyrometer apparatus and method
JP2003318121A (ja) * 2002-04-26 2003-11-07 Trecenti Technologies Inc 半導体装置の製造方法
JP2007081348A (ja) 2005-09-16 2007-03-29 Matsushita Electric Ind Co Ltd 熱処理温度の調整方法、基板熱処理方法、及び基板熱処理装置
JP5006560B2 (ja) * 2006-03-27 2012-08-22 大阪瓦斯株式会社 温度検出方法、温度検出装置及び温度検出装置を備えた加熱調理器
US7398693B2 (en) * 2006-03-30 2008-07-15 Applied Materials, Inc. Adaptive control method for rapid thermal processing of a substrate
JP5507102B2 (ja) * 2009-03-19 2014-05-28 大日本スクリーン製造株式会社 熱処理装置および熱処理方法

Also Published As

Publication number Publication date
KR20220157995A (ko) 2022-11-29
EP4131340A1 (en) 2023-02-08
CN115298802A (zh) 2022-11-04
WO2021192801A1 (ja) 2021-09-30
US20230011199A1 (en) 2023-01-12
EP4131340A4 (en) 2023-10-25

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR102021015500A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)
BR102021015566A2 (ja)
BR102021015450A8 (ja)
BR102021015247A2 (ja)
BR102021015220A2 (ja)
BR102021014056A2 (ja)
BR102021014044A2 (ja)
BR102021013929A2 (ja)
BR112021017747A2 (ja)
BR102021012571A2 (ja)
BR102021012230A2 (ja)
BR102021012003A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230912