JPWO2021192697A1 - - Google Patents

Info

Publication number
JPWO2021192697A1
JPWO2021192697A1 JP2022509384A JP2022509384A JPWO2021192697A1 JP WO2021192697 A1 JPWO2021192697 A1 JP WO2021192697A1 JP 2022509384 A JP2022509384 A JP 2022509384A JP 2022509384 A JP2022509384 A JP 2022509384A JP WO2021192697 A1 JPWO2021192697 A1 JP WO2021192697A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022509384A
Other versions
JP7307270B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021192697A1 publication Critical patent/JPWO2021192697A1/ja
Application granted granted Critical
Publication of JP7307270B2 publication Critical patent/JP7307270B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • ing And Chemical Polishing (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
JP2022509384A 2020-03-25 2021-02-10 構造体の製造方法 Active JP7307270B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020055021 2020-03-25
JP2020055021 2020-03-25
PCT/JP2021/005059 WO2021192697A1 (ja) 2020-03-25 2021-02-10 構造体の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021192697A1 true JPWO2021192697A1 (ja) 2021-09-30
JP7307270B2 JP7307270B2 (ja) 2023-07-11

Family

ID=77890042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509384A Active JP7307270B2 (ja) 2020-03-25 2021-02-10 構造体の製造方法

Country Status (4)

Country Link
US (1) US20220415664A1 (ja)
JP (1) JP7307270B2 (ja)
CN (1) CN115298804A (ja)
WO (1) WO2021192697A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016170727A1 (ja) * 2015-04-20 2016-10-27 富士フイルム株式会社 構造物の製造方法
JP2017107011A (ja) * 2015-12-08 2017-06-15 リコーイメージング株式会社 光学部材及びそれを用いた機器
JP2019040980A (ja) * 2017-08-24 2019-03-14 日機装株式会社 半導体発光素子および半導体発光素子の製造方法
WO2019225518A1 (ja) * 2018-05-22 2019-11-28 富士フイルム株式会社 凹凸構造付き基体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016170727A1 (ja) * 2015-04-20 2016-10-27 富士フイルム株式会社 構造物の製造方法
JP2017107011A (ja) * 2015-12-08 2017-06-15 リコーイメージング株式会社 光学部材及びそれを用いた機器
JP2019040980A (ja) * 2017-08-24 2019-03-14 日機装株式会社 半導体発光素子および半導体発光素子の製造方法
WO2019225518A1 (ja) * 2018-05-22 2019-11-28 富士フイルム株式会社 凹凸構造付き基体の製造方法

Also Published As

Publication number Publication date
WO2021192697A1 (ja) 2021-09-30
US20220415664A1 (en) 2022-12-29
JP7307270B2 (ja) 2023-07-11
CN115298804A (zh) 2022-11-04

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