JPWO2021182365A1 - - Google Patents
Info
- Publication number
- JPWO2021182365A1 JPWO2021182365A1 JP2022507160A JP2022507160A JPWO2021182365A1 JP WO2021182365 A1 JPWO2021182365 A1 JP WO2021182365A1 JP 2022507160 A JP2022507160 A JP 2022507160A JP 2022507160 A JP2022507160 A JP 2022507160A JP WO2021182365 A1 JPWO2021182365 A1 JP WO2021182365A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L37/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020039865 | 2020-03-09 | ||
| PCT/JP2021/008861 WO2021182365A1 (en) | 2020-03-09 | 2021-03-08 | Resin composition and resin sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021182365A1 true JPWO2021182365A1 (en) | 2021-09-16 |
Family
ID=77671726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507160A Pending JPWO2021182365A1 (en) | 2020-03-09 | 2021-03-08 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2021182365A1 (en) |
| CN (1) | CN115279836B (en) |
| TW (1) | TW202140673A (en) |
| WO (1) | WO2021182365A1 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4710277B2 (en) * | 2004-08-17 | 2011-06-29 | Ｄｉｃ株式会社 | Epoxy resin composition and cured product thereof |
| JP5614048B2 (en) * | 2010-02-02 | 2014-10-29 | 日立化成株式会社 | Thermosetting insulating resin composition, and prepreg, laminate and multilayer printed wiring board using the same |
| JP6442281B2 (en) * | 2014-12-26 | 2018-12-19 | 株式会社アドマテックス | Silica-coated organic particles, method for producing the same, and resin composition |
| JP6967508B2 (en) * | 2016-03-31 | 2021-11-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product and printed wiring board |
| WO2018043035A1 (en) * | 2016-08-30 | 2018-03-08 | リンテック株式会社 | Resin composition, resinous sheet, and semiconductor device |
| JP6789374B2 (en) * | 2017-03-13 | 2020-11-25 | リンテック株式会社 | Resin compositions, resin sheets, laminates, and semiconductor devices |
| WO2018211626A1 (en) * | 2017-05-17 | 2018-11-22 | 株式会社アドマテックス | Composite particle material, and production method therefor |
| TWI765028B (en) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | Resin sheet, laminate, and method for producing resin sheet |
| JP7081127B2 (en) * | 2017-12-05 | 2022-06-07 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, prepreg, laminated board, printed wiring board and high-speed communication compatible module |
| JP2019157097A (en) * | 2018-03-17 | 2019-09-19 | 帝人株式会社 | Prepreg and fiber-reinforced composite material, and method for producing same |
| JP6999487B2 (en) * | 2018-05-01 | 2022-01-18 | 信越化学工業株式会社 | Quartz glass fiber-containing substrate |
| JP7329513B2 (en) * | 2018-07-18 | 2023-08-18 | リンテック株式会社 | laminate |
-
2021
- 2021-03-08 CN CN202180020494.8A patent/CN115279836B/en active Active
- 2021-03-08 WO PCT/JP2021/008861 patent/WO2021182365A1/en active Application Filing
- 2021-03-08 JP JP2022507160A patent/JPWO2021182365A1/ja active Pending
- 2021-03-09 TW TW110108275A patent/TW202140673A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN115279836A (en) | 2022-11-01 |
| WO2021182365A1 (en) | 2021-09-16 |
| CN115279836B (en) | 2023-09-08 |
| TW202140673A (en) | 2021-11-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240112 |