JPWO2021182276A1 - - Google Patents

Info

Publication number
JPWO2021182276A1
JPWO2021182276A1 JP2022505992A JP2022505992A JPWO2021182276A1 JP WO2021182276 A1 JPWO2021182276 A1 JP WO2021182276A1 JP 2022505992 A JP2022505992 A JP 2022505992A JP 2022505992 A JP2022505992 A JP 2022505992A JP WO2021182276 A1 JPWO2021182276 A1 JP WO2021182276A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505992A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182276A1 publication Critical patent/JPWO2021182276A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022505992A 2020-03-13 2021-03-04 Pending JPWO2021182276A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020044111 2020-03-13
PCT/JP2021/008366 WO2021182276A1 (ja) 2020-03-13 2021-03-04 研磨用組成物

Publications (1)

Publication Number Publication Date
JPWO2021182276A1 true JPWO2021182276A1 (enrdf_load_stackoverflow) 2021-09-16

Family

ID=77672325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505992A Pending JPWO2021182276A1 (enrdf_load_stackoverflow) 2020-03-13 2021-03-04

Country Status (3)

Country Link
JP (1) JPWO2021182276A1 (enrdf_load_stackoverflow)
TW (1) TW202138534A (enrdf_load_stackoverflow)
WO (1) WO2021182276A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240166015A (ko) * 2022-03-31 2024-11-25 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
WO2025070128A1 (ja) * 2023-09-25 2025-04-03 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
WO2025070129A1 (ja) * 2023-09-25 2025-04-03 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129408A1 (ja) * 2013-02-21 2014-08-28 株式会社フジミインコーポレーテッド 研磨用組成物および研磨物製造方法
WO2014196299A1 (ja) * 2013-06-07 2014-12-11 株式会社フジミインコーポレーテッド シリコンウエハ研磨用組成物
WO2015068672A1 (ja) * 2013-11-08 2015-05-14 東亞合成株式会社 半導体用濡れ剤及び研磨用組成物
US20150210892A1 (en) * 2012-08-31 2015-07-30 Fujimi Incorporated Polishing composition and method for producing substrate
KR20160063320A (ko) * 2013-09-30 2016-06-03 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
WO2017002433A1 (ja) * 2015-07-01 2017-01-05 東亞合成株式会社 研磨用濡れ剤及び研磨液組成物
WO2018043504A1 (ja) * 2016-08-31 2018-03-08 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物セット

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150210892A1 (en) * 2012-08-31 2015-07-30 Fujimi Incorporated Polishing composition and method for producing substrate
WO2014129408A1 (ja) * 2013-02-21 2014-08-28 株式会社フジミインコーポレーテッド 研磨用組成物および研磨物製造方法
WO2014196299A1 (ja) * 2013-06-07 2014-12-11 株式会社フジミインコーポレーテッド シリコンウエハ研磨用組成物
KR20160063320A (ko) * 2013-09-30 2016-06-03 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
US20160215189A1 (en) * 2013-09-30 2016-07-28 Fujimi Incorporated Polishing composition and method for producing same
WO2015068672A1 (ja) * 2013-11-08 2015-05-14 東亞合成株式会社 半導体用濡れ剤及び研磨用組成物
WO2017002433A1 (ja) * 2015-07-01 2017-01-05 東亞合成株式会社 研磨用濡れ剤及び研磨液組成物
WO2018043504A1 (ja) * 2016-08-31 2018-03-08 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物セット

Also Published As

Publication number Publication date
TW202138534A (zh) 2021-10-16
WO2021182276A1 (ja) 2021-09-16

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