JPWO2021181651A1 - - Google Patents
Info
- Publication number
- JPWO2021181651A1 JPWO2021181651A1 JP2022505684A JP2022505684A JPWO2021181651A1 JP WO2021181651 A1 JPWO2021181651 A1 JP WO2021181651A1 JP 2022505684 A JP2022505684 A JP 2022505684A JP 2022505684 A JP2022505684 A JP 2022505684A JP WO2021181651 A1 JPWO2021181651 A1 JP WO2021181651A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B15/00—Generation of oscillations using galvano-magnetic devices, e.g. Hall-effect devices, or using superconductivity effects
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/011035 WO2021181651A1 (ja) | 2020-03-13 | 2020-03-13 | 磁化回転素子、磁気抵抗効果素子、磁気記録アレイ、高周波デバイスおよび磁化回転素子の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021181651A1 true JPWO2021181651A1 (ja) | 2021-09-16 |
JPWO2021181651A5 JPWO2021181651A5 (ja) | 2022-11-09 |
JP7168123B2 JP7168123B2 (ja) | 2022-11-09 |
Family
ID=77671065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022505684A Active JP7168123B2 (ja) | 2020-03-13 | 2020-03-13 | 磁化回転素子、磁気抵抗効果素子、磁気記録アレイ、高周波デバイスおよび磁化回転素子の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230107965A1 (ja) |
JP (1) | JP7168123B2 (ja) |
CN (1) | CN115039235A (ja) |
WO (1) | WO2021181651A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024069733A1 (ja) * | 2022-09-27 | 2024-04-04 | Tdk株式会社 | 磁気抵抗効果素子の製造方法及び磁気抵抗効果素子 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017510016A (ja) * | 2014-01-28 | 2017-04-06 | クアルコム,インコーポレイテッド | 3フェーズgshe−mtj不揮発性フリップフロップ |
WO2017090728A1 (ja) * | 2015-11-27 | 2017-06-01 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子、および磁気メモリ |
JP2018022806A (ja) * | 2016-08-04 | 2018-02-08 | 株式会社東芝 | 磁気記憶装置及びその製造方法 |
JP2019047120A (ja) * | 2017-09-01 | 2019-03-22 | Tdk株式会社 | スピン流磁化反転素子、スピン軌道トルク型磁気抵抗効果素子、磁気メモリ及び高周波磁気素子 |
WO2019138778A1 (ja) * | 2018-01-10 | 2019-07-18 | 国立大学法人東北大学 | 磁気抵抗効果素子及び磁気メモリ |
-
2020
- 2020-03-13 WO PCT/JP2020/011035 patent/WO2021181651A1/ja active Application Filing
- 2020-03-13 CN CN202080095332.6A patent/CN115039235A/zh active Pending
- 2020-03-13 JP JP2022505684A patent/JP7168123B2/ja active Active
- 2020-03-13 US US17/909,950 patent/US20230107965A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017510016A (ja) * | 2014-01-28 | 2017-04-06 | クアルコム,インコーポレイテッド | 3フェーズgshe−mtj不揮発性フリップフロップ |
WO2017090728A1 (ja) * | 2015-11-27 | 2017-06-01 | Tdk株式会社 | スピン流磁化反転素子、磁気抵抗効果素子、および磁気メモリ |
JP2018022806A (ja) * | 2016-08-04 | 2018-02-08 | 株式会社東芝 | 磁気記憶装置及びその製造方法 |
JP2019047120A (ja) * | 2017-09-01 | 2019-03-22 | Tdk株式会社 | スピン流磁化反転素子、スピン軌道トルク型磁気抵抗効果素子、磁気メモリ及び高周波磁気素子 |
WO2019138778A1 (ja) * | 2018-01-10 | 2019-07-18 | 国立大学法人東北大学 | 磁気抵抗効果素子及び磁気メモリ |
Also Published As
Publication number | Publication date |
---|---|
CN115039235A (zh) | 2022-09-09 |
US20230107965A1 (en) | 2023-04-06 |
JP7168123B2 (ja) | 2022-11-09 |
WO2021181651A1 (ja) | 2021-09-16 |
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