JPWO2021177283A1 - - Google Patents

Info

Publication number
JPWO2021177283A1
JPWO2021177283A1 JP2022504383A JP2022504383A JPWO2021177283A1 JP WO2021177283 A1 JPWO2021177283 A1 JP WO2021177283A1 JP 2022504383 A JP2022504383 A JP 2022504383A JP 2022504383 A JP2022504383 A JP 2022504383A JP WO2021177283 A1 JPWO2021177283 A1 JP WO2021177283A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022504383A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177283A1 publication Critical patent/JPWO2021177283A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
JP2022504383A 2020-03-02 2021-03-02 Pending JPWO2021177283A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020035216 2020-03-02
PCT/JP2021/007889 WO2021177283A1 (ja) 2020-03-02 2021-03-02 はんだペースト、はんだペースト用金属被覆粒子及び接続構造体

Publications (1)

Publication Number Publication Date
JPWO2021177283A1 true JPWO2021177283A1 (ja) 2021-09-10

Family

ID=77614072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504383A Pending JPWO2021177283A1 (ja) 2020-03-02 2021-03-02

Country Status (3)

Country Link
JP (1) JPWO2021177283A1 (ja)
TW (1) TW202133976A (ja)
WO (1) WO2021177283A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004249359A (ja) * 2003-02-21 2004-09-09 Sekisui Chem Co Ltd ハンダペースト及び導電接続構造体
JP2006035259A (ja) * 2004-07-27 2006-02-09 Denso Corp ソルダペースト
JP6097162B2 (ja) * 2012-07-02 2017-03-15 積水化学工業株式会社 導電性粒子及びはんだ接合材料
JP2015179732A (ja) * 2014-03-19 2015-10-08 デクセリアルズ株式会社 異方性導電接着剤
JP6106154B2 (ja) * 2014-12-26 2017-03-29 千住金属工業株式会社 はんだ材料の製造方法
JPWO2017179532A1 (ja) * 2016-04-12 2019-02-14 積水化学工業株式会社 導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2021177283A1 (ja) 2021-09-10
TW202133976A (zh) 2021-09-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231204