JPWO2021156805A5 - - Google Patents

Description

The present invention relates to a method for detecting the temperature of a component of a support system of a process pipe of a semiconductor processing device, a reading device for detecting the temperature of a component of a support system of a semiconductor processing device, and a configuration of a support system of a semiconductor processing device. The present invention relates to a radio frequency identification tag, one or more programs, and a machine-readable storage medium for detecting the temperature of an element.

Pipes to and from semiconductor devices for various processes and applications can develop deposits that adversely affect the operation of the pipes. Such semiconductor devices can include semiconductor manufacturing equipment. Deposits may build up as a result of condensation at cold spots. Monitoring temperature at multiple points along a pipe can help identify cold spots, i.e., when the temperature of the fluid within the pipe is below an optimal level to minimize condensate or deposit formation. can help.

In addition, when heating the pipe, for example to prevent condensation formation inside the pipe, the pipe should not become too hot and the safe operating temperature of the pipe contents, pipe material, heating components and any insulation materials. It is important to ensure that the limits are not exceeded. Monitoring temperatures at multiple points along a pipe can help identify hot spots that may be caused by a faulty heater or exothermic reaction within the pipe. Such hot spots can cause equipment failure. Identification of hot spots can be used to perform remedial actions such as shutting down the heater, shutting down the process, or activating a quench function.

Similarly, vacuum pumps and abatement systems for semiconductor processing equipment can be part of an integrated system for semiconductor manufacturing. Such systems typically require a power supply system to provide power at high voltages to the individual modules of the system. Such integrated systems are becoming increasingly complex and compact, and access for repair and maintenance activities becomes more restricted. As a result, advanced, integrated, high voltage electrical assemblies are being relocated to areas that occupy less space and have significantly reduced system maintenance access. Failures in the power supply system can result in costly downtime of equipment that the power supply system powers, such as semiconductor processing equipment. Early signs of failure in such electrical systems can be determined by detecting increases in temperature of components of the power supply system.

Generally, electrical temperature sensors can be used to monitor the temperature of components such as process pipes of semiconductor devices. This may comprise a thermocouple connected to suitable detection circuitry. However, each such thermocouple is a relatively expensive device. Additionally, each thermocouple requires additional wiring and control circuitry, and its complexity increases installation costs. These factors make it inappropriate to install large numbers of such electrical temperature sensors. Furthermore, if insulation jackets and/or heating jackets are applied to the pipes, these can interfere with sensor placement and wiring. In power supply systems, such wiring must be well insulated and protected from high voltage components.

Other electronic temperature sensing devices can use either thermistors, resistance temperature detectors (RTDs), and infrared sensors. Although some of these may be cheaper than thermocouples, they still require the additional cost of cumbersome wiring and/or communication circuitry.

It is also possible to detect temperature with a mechanical switch indicator such as a thermostat or capillary probe. However, these generally give only low resolution measurements, posing additional problems for monitoring and relaying to monitoring devices.

What is needed is an improved configuration for measuring the temperature of components of support systems for semiconductor processing equipment, such as process pipes and power supply systems.

Radio frequency identification (RFID) tags are known to have a resonant frequency response that is temperature dependent. Described herein is a cost-effective method of detecting the temperature of a component, such as a pipe, by adding RFID tags along the pipe length onto the pipe itself. A reader with resonant frequency detection can scan a component to determine the temperature of an RFID tag attached to it. This provides a cost effective way to monitor multiple components within a system, each component having an RFID tag attached to it.

A method of detecting the temperature of a component of a support system for semiconductor processing equipment is provided, the method comprising the steps of: attaching a radio frequency identification tag having a serial number to a pipe; and reading the radio frequency identification tag with a reader. the reader configured to read a serial number of the radio frequency identification tag and determine a resonant frequency of the radio frequency identification tag; and converting the temperature to a temperature of

A component of a support system for semiconductor processing equipment may include a process pipe of the semiconductor processing equipment. Components of a support system for semiconductor processing equipment can include a power supply system that provides electrical power.

Also provided is a method for detecting the temperature of a process pipe of a semiconductor device, the method comprising the steps of: attaching a radio frequency identification tag having a serial number to the process pipe; and reading the radio frequency identification tag with a reader. the reader is configured to read a serial number of the radio frequency identification tag and determine a resonant frequency of the radio frequency identification tag; and converting the resonant frequency of the radio frequency tag to a temperature of the radio frequency identification tag. and steps.

Furthermore, a method for detecting the temperature of a component of a power supply system comprising a busbar and a plurality of electrical modules connected to the busbar is provided, the method comprising the steps of: attaching a radio frequency identification tag having a serial number to the component; and reading the radio frequency identification tag with a reader, the reader configured to read a serial number of the radio frequency identification tag and determine a resonant frequency of the radio frequency identification tag; converting the resonant frequency of the tag to a temperature of the radio frequency identification tag.

In some implementations, multiple RFID tags will be installed. Accordingly, the method may further include recording the serial number and installation location of the radio frequency identification tag in the database when the radio frequency identification tag is attached to the component, and then the temperature reading is obtained. The location of the temperature reading is then determined by looking up the serial number of the radio frequency identification tag in the database.

Additionally, a reader is provided for detecting a temperature of a component of a support system for a semiconductor processing device, the reader including a transmitter, a receiver, and a processor. The transmitter is configured to transmit a signal to a radio frequency identification tag attached to the component, the radio frequency identification tag having a serial number. The receiver is configured to receive a serial number of the radio frequency identification tag. The reader is further configured to identify a resonant frequency of the radio frequency identification tag.

The reader may include a long reading antenna positioned along the length of the component. A long reading antenna can be connected to at least one of the transmitter and receiver.

The component and the RFID tag are in thermodynamic equilibrium such that the temperature of the component can be determined to be the same as the temperature of the radio frequency identification tag.

Determining the resonant frequency of the radio frequency identification tag includes transmitting a series of different frequency signals to the radio frequency identification tag and determining the signal strength of the signals received from the radio frequency identification chip for each different frequency signal. can be included. This is suitable for passive RFID tags.

Determining the resonant frequency of the radio frequency identification tag may include detecting a frequency of a signal received from the radio frequency identification chip. This is suitable for RFID tags that include a battery, such as active RFID tags, and battery-assisted passive RFID tags.

Additionally, a radio frequency identification tag is provided for detecting a temperature of a component of a support system for semiconductor processing equipment, the radio frequency identification tag having an antenna configured to be placed in thermal communication with the component. a case, and an electrically insulating pad separating the antenna from the component, the electrical component being configured to be electrically coupled to the antenna and remote from the component.

Additionally, a radio frequency identification tag is provided for detecting a temperature of a process pipe of a semiconductor device, the radio frequency identification tag having an antenna configured to be placed in thermal communication with the process pipe and an electrically insulating pad. , an electrically insulating pad separates the antenna from the process pipe, and an electrical component is configured to be electrically coupled to the antenna and remote from the process pipe.

Additionally, a radio frequency identification tag is provided for detecting a temperature of a component of the power supply system, the radio frequency identification tag having an antenna configured to be placed in thermal communication with the component and an electrically insulating pad. and an electrically insulating pad separating the antenna from the component, the electrical component being configured to be electrically coupled to the antenna and remote from the component.

The antenna, electrical insulation pads, and electrical components can be housed within the case. The case can be a polyimide case. The electrically insulating pad can be a thermally conductive electrical insulator. The electrical insulation pad can provide good thermal conductivity between the components and the electrical parts of the radio frequency identification tag.

Electrical components can be separated from the antenna by communication lines. Electrical components can be placed within the tail of the RFID tag.

The insulation pad can be an electrically insulating thermally conductive pad. Such pads can be formed from silicone rubber or epoxy compounds filled with boron nitride or aluminum nitride. Illustratively, aluminum nitride has a thermal conductivity up to 285 W/mK, but is a semiconductor. This is comparable to known metallic thermal conductors such as copper, which has a thermal conductivity of 385 W/mk.

The RFID tag can be built into the heating pad, and the heating pad is arranged to be fixed to the exhaust pipe. The heating pad can be an electrically insulating pad. The electrically insulating pad can be part of a heating pad that includes a heating element. The heating element may include an electrical heating wire. The antenna and electrical components can be housed within the case. The case can be a polyimide case.

The radio frequency identification tag can further include an adhesive pad that attaches the insulating pad to the component. The adhesive pad can include thermal adhesive tape. For example, 3M® 8810 thermally conductive adhesive transfer tape is designed to provide a preferential heat transfer path between the heat generating component and the parts attached to it.

The radio frequency identification tag can be one of a passive tag, an active tag, and a battery-assisted passive tag.

The electrical component may include a memory that stores a serial number that is transmitted from the radio frequency identification tag when the radio frequency identification tag is interrogated.

Once the radio frequency identification tag is installed, the serial number and location of the radio frequency identification tag are recorded, and then, when a temperature reading is obtained, the location of the temperature reading can be determined. There is.

The electrical insulation pad can provide good thermal conductivity between the components and the electrical parts of the radio frequency identification tag. The radio frequency identification tag may further include a thermal insulation layer that separates the electrical components of the radio frequency identification tag from the antenna, electrical isolation pads, and components.

Additionally, one or more instructions are configured to, when executed by a computer system or one or more processors, cause the computer system or one or more processors to operate in accordance with the methods described herein. program will be provided.

Furthermore, a machine-readable storage medium is provided that stores at least one of the one or more programs described herein.

3 illustrates an example component whose temperature is to be determined. A radio frequency identification tag is shown detecting the temperature of a component. A radio frequency identification tag is shown detecting the temperature of a component. A radio frequency identification tag is shown detecting the temperature of a component. 3 illustrates different uses of RFID tags as described herein. 3 illustrates different uses of RFID tags as described herein. 3 illustrates different uses of RFID tags as described herein. Demonstrates a method for detecting the temperature of a component. Figure 3 shows a reader for detecting the temperature of a component. 1 is a schematic diagram (not to scale) illustrating a power supply system including a temperature sensing arrangement as described herein; FIG. 2 is a schematic diagram (not to scale) showing a detailed view of a busbar incorporating a plurality of RFID tags as described herein; FIG.

All drawings are for illustrative purposes only and are not to scale.

RFID tags include at least two components: an integrated circuit that stores and processes information and modulates and demodulates radio frequency (RF) signals, and an antenna that transmits and receives signals. The tag information is stored in non-volatile memory that is part of the integrated circuit. The reader transmits an encoded radio signal to interrogate the tag. The RFID tag receives the message and then responds with a unique serial number. Because the tags have individual serial numbers, the RFID system design can distinguish between tags that may be within range of the RFID reader's antenna and read the tags at the same time.

Radio frequency identification tags include an integrated circuit electrically connected to an antenna. The integrated circuit includes memory components that store information such as serial numbers and communication circuitry that transmits and receives wireless signals.

Radio frequency identification tags are powered in a variety of ways. The passive tag includes means for collecting DC power from the incident reader signal to power the RFID tag and transmitter. Active tags include a power source, typically an onboard battery, and periodically transmit an ID signal. A battery-assisted passive tag is equipped with a small battery, and the RFID tag is activated when an interrogation signal is received from an RFID reader. The battery and chip are the electrical components of the RFID tag and are referred to herein as electrical components. These electrical components are electrical components other than the antenna.

The information stored on the radio frequency identification tag is typically a serial number, which is unique and transmitted by the radio frequency identification tag when it is interrogated. The serial number is stored in a memory component of the chip.

FIG. 1 shows exemplary components whose temperature will be determined. In this example, the component is a process pipe 110 that carries hot gas from left to right. Such pipes are examples of components of support systems for semiconductor processing equipment. The hot gas includes steam that causes condensation deposits 115 within pipe 110. In the illustrated example, a pool of condensate 115 tends to occur after the second bend in pipe 110. Such pipes can carry feed gas to semiconductor processing equipment or carry spent gas away from conductor processing equipment. Such spent gas can be treated by an abatement system. In this context, "semiconductor processing equipment" refers to equipment suitable for processing semiconductor materials, such as wafers, to produce semiconductor devices such as transistors, memories, or processors. Another example of a component of a support system for semiconductor processing equipment is a bus bar of a power supply system.

FIG. 2A shows a radio frequency identification tag 200 that detects the temperature of a component 210. Component 210 may be a pipe. Component 210 may be a busbar interconnect. Radio frequency identification tag 200 includes an antenna 220, a polyimide case 230, and an insulating pad 240. An insulating pad 240 separates antenna 220 from component 210.

Antenna 220 is part of the electronics layer of the RFID tag. The electronic component layer includes the integrated circuit of the RFID tag. The integrated circuit is not shown separately in FIG.

FIG. 2A further shows an adhesive pad 250 adhering/adhering the insulating pad 240 to the component 210. Adhesive pad 250 is a thermal adhesive tape, an example of which is 3M® 8810 thermally conductive adhesive transfer tape. Such tapes are designed to provide preferential heat transfer paths between heat generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes. Adhesive pad 250 is optional, as RFID tag 200 can be held in place by other means, such as a strap, or incorporated into another piece secured to a component, such as an insulating jacket. be. For example, the RFID tag can be embedded in a heating pad that is positioned to be secured to component 210.

The insulation pad 240 is an electrical insulator that improves the operation of the antenna 220 and provides good thermal conductivity between the antenna 220 and the components 210 within the electronics layer of the radio frequency identification tag.

Insulating pad 240 is an electrically insulating thermally conductive pad. Insulating pad 240 increases the distance separation between antenna 220 and component 210. In some implementations, component 210 is made of metal and is therefore electrically conductive. An advantage of insulating pad 240 is that it improves the wireless operation of antenna 220 when RFID tag 200 is attached to metal component 210.

Insulating pad 240 is formed of silicone rubber containing zinc oxide filler to increase thermal conductivity. Alternatively, insulating pad 240 includes an epoxy compound filled with boron nitride or aluminum nitride. Illustratively, aluminum nitride has a thermal conductivity up to 285 W/mK, but is a semiconductor. This is comparable to known metallic thermal conductors such as copper, which has a thermal conductivity of 385 W/mk.

FIG. 2B shows another configuration of RFID tag 202 to detect the temperature of component 210. RFID tag 202 includes an electrically insulating pad 240, an antenna 222, an electrically insulating pad 260, a connecting line 270, and an electrical component 224. Antenna 222 and electrical component 224 are electrically connected by connection line 270. RFID tag 202 includes a separate antenna and electrical components, the antenna being in thermal communication with component 210 and electrical component 224 being separated from antenna 222 and component 210 by insulation. There is. Therefore, during operation, the electrical components 224 of the RFID tag 202 tend to be at a lower temperature than the components 210. This can improve the operating temperature range and/or lifetime of the RFID tag 202.

FIG. 2C shows another configuration of RFID tag 204 to detect the temperature of component 210. RFID tag 204 includes an electrically insulating pad 240, an antenna 222, a connecting wire 270, and an electrical component 224. Antenna 222 and electrical component 224 are electrically connected by connection line 270. RFID tag 204 includes a separate antenna and electrical component, the antenna being in thermal communication with component 210 and electrical component 224 being separated from antenna 222 by a length of connecting line 270. ing. The connecting line 270 and the electrical component 224 refer to the tail of the RFID tag 204. The tail allows electrical components to be spatially separated from component 210. In use, electrical components 224 may be placed in a lower temperature environment, such as ambient temperature. Therefore, during operation, electrical components 224 of RFID tag 204 tend to be at a lower temperature than components 210. This can improve the operating temperature range and/or lifetime of the RFID tag 204.

FIG. 3A shows two RFID tags 300 attached to a pipe 310 at different locations. FIG. 3B shows an RFID tag 300 attached to a pipe 310, with insulation 380 attached above the RFID tag 300. Preferably, the insulation additionally covers the RFID tag 300 to ensure accurate temperature readings of the pipe 310. FIG. 3C shows the RFID tag 300 as part of a heating jacket 390 that is attached to the pipe 310 and thus holds the RFID tag 300 relative to the pipe 310. To ensure accurate temperature readings, the heating element within the heating jacket is preferably placed between the RFID tag and the pipe 310 or on the RFID tag 300 adjacent to the polyimide case 230 and internal electronics layers. Not installed. Pipe 310 may be an exhaust pipe from semiconductor processing equipment.

If the RFID tag 300 is covered by a jacket, indicia such as marks, color patches, or stickers can be provided on the outer surface of the jacket to allow the installed RFID tag to be more easily located after installation.

FIG. 4 shows a method 400 for detecting temperature of a component. The method 400 includes attaching 420 a radio frequency identification tag having a serial number of S2 to the component, and reading 430 the radio frequency identification tag of S3 with a reader, the reader having a serial number of S2. The method includes steps configured to read the serial number and determine a resonant frequency of the radio frequency identification tag, and converting the resonant frequency of the radio frequency tag of S4 to a temperature of the radio frequency identification tag.

Converting 440 the detected resonant frequency to temperature is performed using a lookup table. A look-up table is configured with respect to the type of RFID tag and allows the detected resonant frequency to be converted into a temperature reading. Alternatively, each RFID tag is calibrated prior to installation to determine the relationship between temperature and resonant frequency for each particular RFID tag. This information is stored in a lookup table along with the RFID tag serial number. After installation, once the resonant frequency of the RFID tag is determined along with the serial number, the serial number is used to determine the relationship between resonant frequency and temperature for that given RFID tag.

In some implementations, multiple RFID tags will be installed. Accordingly, the method includes a step 410 of recording the serial number and installation location of the S1 radio frequency identification tag in a database once the radio frequency identification tag is attached to the component, and then once the temperature reading is obtained ( step 440), and step 450 of determining the location of the temperature reading by examining the serial number of the radio frequency identification tag in S5's database.

FIG. 5 shows a reader 500 that detects the temperature of a component. The reading device includes a transmitter 510, a receiver 515, and a processor 520. Transmitter 510 is configured to transmit a signal to a radio frequency identification tag having a serial number attached to the component. Reader 515 is configured to receive the serial number of the radio frequency identification tag. Processor 520 is configured to use receiver 515 to determine the resonant frequency of the radio frequency identification tag. Processor 520 is further configured to convert the resonant frequency of the wireless tag to a temperature of the radio frequency identification tag.

Reading device 500 further includes a user interface 540. User interface 540 allows a user to enter commands into reader 500 and allows reader 500 to display information to the user. User interface 540 may be a touch screen interface. Processor 520 can be configured to receive instructions, which, when executed, cause processor 520 to perform the methods described above. The instructions may be stored in memory 525.

If multiple RFID tags are installed, the reader 500 is configured to record the serial number and installation location of each radio frequency identification tag in the database 530. Thereafter, once the temperature indication is obtained, processor 520 determines the location of the temperature indication by examining the serial number of the radio frequency identification tag in the database.

Generally, the component and the RFID tag are in thermodynamic equilibrium and the temperature of the component can be determined to be the same as the temperature of the radio frequency identification tag.

Determining the resonant frequency of the radio frequency identification tag includes transmitting a series of different frequency signals to the radio frequency identification tag and determining the signal strength of the signals received from the radio frequency identification chip for each different frequency signal. can be included. This is suitable for passive RFID tags.

Determining the resonant frequency of the radio frequency identification tag may include detecting a frequency of a signal received from the radio frequency identification chip. This is suitable for RFID tags that include a battery, such as active RFID tags, and battery-assisted passive RFID tags.

Once the radio frequency identification tag is installed, the radio frequency identification tag's serial number and installation location are recorded so that the location of the temperature reading can be determined when the temperature reading is subsequently obtained. . Such information is preferably stored in a database. The database can be stored on a reading device.

The reading device can be a mobile device that incorporates a transceiver that interrogates the RFID tag. Such reading devices are well suited to passive RFID tags, which need to transmit a relatively strong signal and require a relatively close receiver to detect its transmission.

The reading device may be a centrally located device with multiple external antennas oriented to interrogate RFID tags at sublocations of the facility. For example, a scene can be divided into multiple regions, each region having a respective antenna interrogating RFID tags within it. A centrally located reading device can then interrogate each area and then verify the temperature readings from multiple RFID tags therein.

The reading device may include at least one long reading antenna device, the long reading antenna connected to at least one of the transmitter and the receiver. A long read antenna device may include a read antenna with a leaky coaxial cable. Such an antenna can read multiple RFID tags along its length. A long read antenna device is placed near the one or more RFID tags and along the exhaust piping to be monitored.

Using antennas along the length of a single exhaust pipe allows for separate readings with system-specific or pipe-specific microcircuits. By reading in this manner, the identification of problem areas can be quickly isolated. With such a configuration, it is also possible to ensure the safety of personnel and equipment during processing in response to thermal events of the processing equipment being pumped into the exhaust pipe.

One or more programs configured to, when executed by a computer system or one or more processors, cause the computer system or one or more processors to operate according to the methods described herein. provided.

A machine-readable storage medium is further provided that stores at least one of the one or more programs described herein.

In the example above, a temperature measurement of a pipe is performed. The invention can also be applied to power supply systems including, but not limited to, busbars. Also provided are methods for detecting thermal cycles in components of power supply systems, vacuum pumps and abatement systems for semiconductor processing equipment, and compressor systems for hydrocarbon processing.

FIG. 6 is a schematic diagram (not to scale) illustrating a power supply system 600 including a fault detection arrangement as described herein. System 600 includes a bus bar 610, a plurality of electrical modules 630, a plurality of interconnect elements 640, and a plurality of RFID tags 660 as described herein.

A plurality of electrical modules 630 are connected to bus bar 610 by a respective plurality of interconnect elements 640, where bus bar 610, interconnect element 640, and electrical module 630 comprise a plurality of components.

The bus bar 610 is. Power is received from the power source and provided to the plurality of modules 630. Interconnect components 640 provide electrical connections between each module 630 and bus bar 640. Busbars provide a space-efficient power supply system for complex electrical installations and are typically used where a compact solution is required.

Illustratively, semiconductor manufacturing facilities will use vacuum and abatement systems to provide vacuum for certain processes, such as etching or deposition. Such a vacuum is typically maintained at a pressure on the order of 1 mbar. Any gases produced from semiconductor processing pass through an abatement system. In such installations, each pump may consume one kilowatt (kW) or more of power, each module 630 may include one or more pumps, and multiple modules 630 (e.g. 10 or 11 or more) can be connected to the bus bar 610. Therefore, bus bar 610 can be expected to transmit tens of kW of power within a small physical space. Bus bar 610 typically transmits power as three voltage phases, so it includes at least three electrical conductors, each of which can be a copper rod or cable. The common voltage of the three-phase power supply is 480 volts.

A failure in the power supply system can be detected by an increase in operating temperature in any one of the components of the system. Such components may include interconnect element 640. An increase in the operating temperature of a component is often caused by an increase in the resistance of said component. The component can be a power semiconductor device, such as an integrated gate bipolar transistor (IGBT), or a screw in a clamp housing that holds two conductors together. The increase in resistance may be the result of deterioration of the power semiconductor components or loosening of the coupling means, such as the screws of the clamps that couple the two conductors together. In the case of power semiconductor devices, increased operating temperatures can accelerate aging or fatigue of the power semiconductor devices. Similarly, an increase in the operating temperature of a loosened physical coupling means can occur when the coupling means undergoes thermal cycling between the high temperature and relative low temperature of the respective operating and non-operating modes. may be further loosened. In either case, an increase in the operating temperature of a component indicates the possibility of future failure of that component.

Traditional monitoring techniques for power supply systems have utilized electrical temperature sensors, such as a combination of high voltage insulated infrared sensors and traditional thermocouples. These sensors are placed at predetermined locations allowing measurements of very important components of the power supply system.

Thermal monitoring of electrical systems, such as power supply systems, can provide real-time temperature data that allows operators to maximize load efficiency and balance thermal stresses that can lead to critical failures. can. Over time, switchgear contacts, busbars, and critical connection points develop hot spots that gradually corrode, causing an increase in electrical resistance. Even a small increase in resistance can quickly get out of control if left unchecked, as higher resistance results in a hotter conductor, resulting in higher resistance.

Problems associated with such conventional monitoring techniques are, for example, as follows.
a. The excessive size of each sensor does not contribute to the miniaturization and space saving requirements of the electrical system.
b. Infrared sensors generally need to be placed approximately 20 mm away from the component under test and will not work if attached directly to the component. This tends to increase the volume of space occupied by the surveillance technology.
c. Dust accumulation and contamination can affect the calibration of infrared sensors.
d. Each sensor mounting bracket requires a large amount of space.
e. Variations in the test material and workmanship of a monitored component, such as the same component type from different manufacturing batches, can affect its emissivity and affect the accuracy of infrared measurements.
f. Each sensor typically needs to be wired individually, which leads to excessive wiring space requirements. Infrared sensors and thermocouples are electrical sensors that typically require their own electrical wiring. Multiple individual sensors require significant wiring complexity and control infrastructure.
g. Electrical sensors require conductive wiring that must be isolated from any high voltage components such as busbars. Such wiring tends to need to be robust in order to function safely in the high voltage environment of power supply systems.

Large electrical systems tend to have a large number of bolted connections. However, in the prior art of temperature measurement, the number of coupling means that can be monitored in real time is limited, mainly due to the above-mentioned problems. Because of these limitations, there is only limited certainty that monitoring will provide sufficient information to reduce operating costs by allowing longer service intervals and fewer visual inspections.

The above problem tends to be addressed by a system 600 such as that shown in FIG. 6 that applies multiple RFID tags 660. Each RFD tag 660 has a unique serial number and is attached to a component of the power supply system.

FIG. 7 is a schematic diagram (not to scale) showing a detailed view of a power supply system 700 comprising a busbar incorporating a plurality of RFID tags 760. Interconnection elements 740 for the two modules are shown attached to busbar 710. Nine RFID tags 760 are attached to each set of interconnect elements 740 at nine measurement points per set of interconnect elements 740. At each measurement point, an RFID tag 760 is connected to a component of interconnection element 740.

The coupling means between the RFID tag 760 and, for example, the components of the interconnection element 740 can be provided by, for example, adhesive, tape, cable ties, or mechanical clips. Depending on practical considerations and constraints such as available space and component geometry, different coupling means may be used for different components. For example, the attachment solution for each RFID tag 760 cable can be a simple adhesive pad bonded directly to the busbar. Typically, each RFID tag 760 is held adjacent to and in contact with the component to be monitored. The configuration described above provides an improved temperature sensing configuration that can be added to a support system of semiconductor processing equipment.

For example, one of the larger cost additions to heating piping is the hardware required to acquire temperature readings and how many acquisition points are required. A cost-effective method of detecting temperature by RFID tags embedded within the heater structure or affixed along the length of the pipe itself is presented herein. A heater controller is located with a UHF RFID reader using resonant frequency detection that scans the entire line. The serial number of each RFID tag is then determined and the corresponding temperature determined from the resonant frequency. This provides a cost-effective way to monitor the entire line, where an alarm system for exothermic events, line length continuity of temperature, and other analytical results can be determined. By correlating the set point to the resonant frequency range, the scan band can be narrowed to speed up the time to acquire all temperatures. For example, each RFID tag can be first scanned at a resonant frequency that is expected to give a predicted temperature at that location. Therefore, the RFID tags described herein can be installed in all heaters down the line, effectively making all heaters a readable temperature point for indication, control, and other applications. Based input is greatly improved.

Use of the described system has several important advantages over the prior art.
a. RFID tags can be attached directly to components such as busbars and critical coupling means, maximizing the flexibility of sensor location and minimizing the space requirements required to accommodate the sensors and fixtures. can be suppressed to
b. Wireless measurements remain unaffected by factors other than the temperature of the component at the time of the test, such as the surface finish or material of the component.
c. The exact sensor location can be selected at the time of installation and is not limited by issues such as wiring length that affect electrical sensors.
d. The space savings of using RFID tags versus wired sensors allows for far more temperature measurement locations within the power supply system, allowing different RFID tags to be assigned to measure the temperature of a single critical component. It even allows the possibility of redundant measurements with two spatially separated fiber Bragg gradings at the tag.
e. The RFID tag is housed within an electrically insulating envelope and does not require conductive wiring to the control device. RFID tags do not require insulated wires or additional insulation from electrical components, which means there are fewer restrictions on sensor placement within the power supply system for RFID tags when compared to electrically wired sensors.

Thus, the systems and methods described herein provide design flexibility, meaning that many additional components that were previously not considered critical can be thermally monitored. The thermal monitoring systems and methods described above tend to enable fundamental changes to the maintenance area of power supply systems as described herein. In addition, by being able to monitor the temperatures of so many components, system operators can quickly verify that the electrical system is operating optimally and as temperatures rise on a particular component if a failure begins to occur. You can be confident that it can be detected. This confidence allows system operators to reduce the amount of preventive maintenance and operate the system with longer service intervals. Accordingly, the systems and methods described herein reduce downtime and reduce costs. Furthermore, the described systems and methods can be implemented with small space requirements, which is important in systems requiring space-efficient power supplies in the form of busbars.

Further provided are vacuum pumps and abatement systems for semiconductor processing equipment that can include power supply systems as described herein.

Further provided is a compressor system for hydrocarbon processing that can be equipped with a power supply system as described herein.

The RFID tags described herein are designed to operate at temperatures up to 260° C., so polyimide films are used to encapsulate the electronic components. In certain implementations, operation up to 200° C. is acceptable, and in such situations the polyimide casing can be replaced with silicone. In other embodiments, materials other than polyimide and silicone are used in RFID tags. Any electrically insulating material that is appropriate to the expected temperature of the exhaust pipe and that allows radio frequencies to pass through the case and into the RFID antenna may be used.

Using RFID tags and the property of temperature-dependent resonant frequency shifts makes it possible to monitor the temperature of components such as process pipes or power supply systems without the need for expensive analytical chips, wiring, and sensing devices. This is a highly efficient method.

The apparatus for detecting the temperature of the components, performing the configurations described above, and performing the steps of the methods described herein may include any suitable apparatus, such as one or more computers or other processing devices or processors. It can be provided by configuring or adapting and/or by providing additional modules. The apparatus comprises instructions in the form of one or more computer programs stored in or on a machine-readable storage medium such as a computer memory, computer disk, ROM, PROM, etc., or any combination of the above or other storage media. and data, and may include a computer, network of computers, or one or more processors that execute the instructions and use the data. Additional modules may include UHF antennas suitable for interrogating the RFID tags described herein.

Note that some of the process steps shown in the flowchart of FIG. 4 above may be omitted, or such process steps may be performed in a different order than shown in FIG. 4 above. I want to be Furthermore, although all process steps have been shown as separate, sequential steps in time for convenience and ease of understanding, some of the process steps may actually overlap simultaneously or at least to some extent in time. can be executed.

It is noted that the above-described embodiments are illustrative rather than restrictive of the invention, and that those skilled in the art can design many other embodiments without departing from the scope of the appended claims. The word ``comprising'' does not exclude the presence of elements or steps other than those listed in a claim, and the singular ``a'' or ``an'' does not exclude a plurality, and the term ``comprising'' does not exclude the presence of elements or steps other than those listed in a claim, nor does the singular ``a'' or ``an'' exclude a plurality of elements or steps other than those listed in a claim. , may fulfill the functions of several units recited in the claims. Any reference signs in the claims shall not be construed as limiting their scope.

110 Process pipe 115 Deposit 200 RFID tag 202 RFID tag 204 RFID tag 210 Component 220 Antenna 222 Antenna 224 Electrical component 230 Polyimide case 240 Electrical insulation pad 250 Adhesive pad 260 Insulation pad 270 Connection wire 300 RFID tag 310 Pipe 380 Heating jacket 390 Heating jacket 510 Transmitter 515 Receiver 520 Processor 525 Memory 530 Database 540 User interface 600 Power supply system 610 Busbar 630 Electrical module 640 Interconnection element 660 RFID tag 700 Power supply system 710 Busbar 740 Interconnection element 760 RFID tag

Claims (9)

A method for detecting the temperature of a process pipe (110; 310) of a semiconductor processing device, the method comprising:
adding a radio frequency identification tag (200; 202; 204; 300) having a serial number to the process pipe (110; 310);
reading the radio frequency identification tag (200; 202; 204; 300) with a reading device (500), the reading device (500) configured to read the serial number of the radio frequency identification tag (200; 202; 204; 300) to determine a resonant frequency of the radio frequency identification tag (200; 202; 204; 300);
converting the resonant frequency of the radio frequency identification tag (200; 202; 204; 300) into a temperature of the radio frequency identification tag (200; 202; 204; 300);
including;
Furthermore, the method includes:
When the radio frequency identification tag (200; 202; 204; 300) is attached to the process pipe (110; 310), the serial number of the radio frequency identification tag (200; 202; 204; 300) in the database and recording the installation location;
Once a temperature indication is obtained, the location of the temperature indication is determined by examining the serial number of the radio frequency identification tag (200; 202; 204; 300) in the database. The method of claim 1, wherein the process pipe (110; 310) is determined to be at the same temperature as the radio frequency identification tag (200; 202; 204; 300). A process pipe of a semiconductor processing equipment including a radio frequency identification tag (200; 202; 204; 300) for detecting the temperature of the process pipe (110; 310), the process pipe comprising:
The radio frequency identification tag (200; 202; 204; 300)
an antenna (220; 222) disposed in thermal communication with the process pipe (110; 310);
an electrically insulating pad (240), said electrically insulating pad (240) separating said antenna (220; 222) from said process pipe (110; 310);
and a memory for storing a serial number.
the serial number is transmitted by the radio frequency identification tag (200; 202; 204; 300) when the radio frequency identification tag (200; 202; 204; 300) is queried;
process pipe. The radio frequency identification tag (200; 202; 204; 300) comprises an electrical component, the electrical component including a memory, and electrically coupled to the antenna (220; 222). separated,
The process pipe according to claim 3. further comprising an electrically insulating layer (260);
The electrically insulating layer (260) connects electrical components (224) of the radio frequency identification tag (200; 202; 204; 300) to the antenna (220; 222), the electrically insulating pad (240), and the process. separated from the pipe (110; 310);
The process pipe according to claim 4. The antenna (220:222) and the electrical component (224) are housed in a case.
The process pipe according to claim 4 or 5. further comprising an adhesive pad (250) for attaching the electrically insulating pad (240) to the process pipe (110; 310);
The process pipe according to any one of claims 3 to 6. the electrically insulating pad (240) is an electrical insulator and thermally conductive;
The process pipe according to any one of claims 3 to 7. The radio frequency identification tag (200; 202; 204; 300)
Radio frequency identification tag according to any one of claims 3 to 8, which is one of a passive tag, an active tag, and a battery-assisted passive tag.