JPWO2021149532A1 - - Google Patents
Info
- Publication number
- JPWO2021149532A1 JPWO2021149532A1 JP2021573073A JP2021573073A JPWO2021149532A1 JP WO2021149532 A1 JPWO2021149532 A1 JP WO2021149532A1 JP 2021573073 A JP2021573073 A JP 2021573073A JP 2021573073 A JP2021573073 A JP 2021573073A JP WO2021149532 A1 JPWO2021149532 A1 JP WO2021149532A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020008553 | 2020-01-22 | ||
| JP2020008553 | 2020-01-22 | ||
| PCT/JP2021/000649 WO2021149532A1 (en) | 2020-01-22 | 2021-01-12 | Substrate processing device and substrate processing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021149532A1 true JPWO2021149532A1 (en) | 2021-07-29 |
| JPWO2021149532A5 JPWO2021149532A5 (en) | 2022-09-06 |
| JP7291809B2 JP7291809B2 (en) | 2023-06-15 |
Family
ID=76992212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021573073A Active JP7291809B2 (en) | 2020-01-22 | 2021-01-12 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7291809B2 (en) |
| CN (1) | CN114946013A (en) |
| WO (1) | WO2021149532A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111542A (en) * | 1984-11-06 | 1986-05-29 | Matsushita Electric Ind Co Ltd | Wafer drying method |
| JP2001087719A (en) * | 1999-09-21 | 2001-04-03 | Sharp Corp | Cleaning method and cleaning device of substrate |
| JP2005302831A (en) * | 2004-04-07 | 2005-10-27 | Disco Abrasive Syst Ltd | Grinder |
| JP2013175672A (en) * | 2012-02-27 | 2013-09-05 | Dainippon Screen Mfg Co Ltd | Cleaning treatment apparatus and cleaning treatment method |
| JP2019093474A (en) * | 2017-11-22 | 2019-06-20 | 東京エレクトロン株式会社 | Substrate processing system |
-
2021
- 2021-01-12 JP JP2021573073A patent/JP7291809B2/en active Active
- 2021-01-12 WO PCT/JP2021/000649 patent/WO2021149532A1/en active Application Filing
- 2021-01-12 CN CN202180008697.5A patent/CN114946013A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111542A (en) * | 1984-11-06 | 1986-05-29 | Matsushita Electric Ind Co Ltd | Wafer drying method |
| JP2001087719A (en) * | 1999-09-21 | 2001-04-03 | Sharp Corp | Cleaning method and cleaning device of substrate |
| JP2005302831A (en) * | 2004-04-07 | 2005-10-27 | Disco Abrasive Syst Ltd | Grinder |
| JP2013175672A (en) * | 2012-02-27 | 2013-09-05 | Dainippon Screen Mfg Co Ltd | Cleaning treatment apparatus and cleaning treatment method |
| JP2019093474A (en) * | 2017-11-22 | 2019-06-20 | 東京エレクトロン株式会社 | Substrate processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114946013A (en) | 2022-08-26 |
| WO2021149532A1 (en) | 2021-07-29 |
| JP7291809B2 (en) | 2023-06-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220708 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220708 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230228 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230418 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230509 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230605 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7291809 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |