JPWO2021125308A1 - - Google Patents

Info

Publication number
JPWO2021125308A1
JPWO2021125308A1 JP2021565669A JP2021565669A JPWO2021125308A1 JP WO2021125308 A1 JPWO2021125308 A1 JP WO2021125308A1 JP 2021565669 A JP2021565669 A JP 2021565669A JP 2021565669 A JP2021565669 A JP 2021565669A JP WO2021125308 A1 JPWO2021125308 A1 JP WO2021125308A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021565669A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021125308A1 publication Critical patent/JPWO2021125308A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2021565669A 2019-12-20 2020-12-18 Pending JPWO2021125308A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019230671 2019-12-20
PCT/JP2020/047337 WO2021125308A1 (en) 2019-12-20 2020-12-18 Release layer forming composition

Publications (1)

Publication Number Publication Date
JPWO2021125308A1 true JPWO2021125308A1 (en) 2021-06-24

Family

ID=76476740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565669A Pending JPWO2021125308A1 (en) 2019-12-20 2020-12-18

Country Status (3)

Country Link
JP (1) JPWO2021125308A1 (en)
TW (1) TW202138431A (en)
WO (1) WO2021125308A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220056213A1 (en) * 2020-08-19 2022-02-24 National Chunghsing University Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic device
TWI742945B (en) * 2020-11-27 2021-10-11 國立中興大學 Low-dissipation flexible copper-coated laminate, manufacturing method thereof, and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222780A (en) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd Thin film transistor substrate and method of manufacturing thin film transistor
KR102528185B1 (en) * 2015-02-10 2023-05-03 닛산 가가쿠 가부시키가이샤 Composition for forming release layer
TWI817931B (en) * 2016-08-03 2023-10-11 日商日產化學工業股份有限公司 laminated body

Also Published As

Publication number Publication date
WO2021125308A1 (en) 2021-06-24
TW202138431A (en) 2021-10-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231121