JPWO2021117345A1 - - Google Patents
Info
- Publication number
- JPWO2021117345A1 JPWO2021117345A1 JP2021563769A JP2021563769A JPWO2021117345A1 JP WO2021117345 A1 JPWO2021117345 A1 JP WO2021117345A1 JP 2021563769 A JP2021563769 A JP 2021563769A JP 2021563769 A JP2021563769 A JP 2021563769A JP WO2021117345 A1 JPWO2021117345 A1 JP WO2021117345A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019224803 | 2019-12-12 | ||
PCT/JP2020/039343 WO2021117345A1 (ja) | 2019-12-12 | 2020-10-20 | チップ部品およびチップ部品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021117345A1 true JPWO2021117345A1 (ja) | 2021-06-17 |
Family
ID=76328877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021563769A Pending JPWO2021117345A1 (ja) | 2019-12-12 | 2020-10-20 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2021117345A1 (ja) |
WO (1) | WO2021117345A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266421A (ja) * | 2006-03-29 | 2007-10-11 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP2009158589A (ja) * | 2007-12-25 | 2009-07-16 | Sanyo Electric Co Ltd | メサ型半導体装置及びその製造方法 |
JP2009267032A (ja) * | 2008-04-24 | 2009-11-12 | Toyota Motor Corp | 半導体装置とその製造方法 |
JP5475363B2 (ja) * | 2009-08-07 | 2014-04-16 | ラピスセミコンダクタ株式会社 | 半導体装置およびその製造方法 |
KR20120104198A (ko) * | 2009-11-10 | 2012-09-20 | 로무 가부시키가이샤 | 반도체 장치 및 반도체 장치의 제조 방법 |
JP2013232620A (ja) * | 2012-01-27 | 2013-11-14 | Rohm Co Ltd | チップ部品 |
JP6723689B2 (ja) * | 2014-05-16 | 2020-07-15 | ローム株式会社 | チップ部品およびその製造方法、ならびにそれを備えた回路アセンブリおよび電子機器 |
-
2020
- 2020-10-20 JP JP2021563769A patent/JPWO2021117345A1/ja active Pending
- 2020-10-20 WO PCT/JP2020/039343 patent/WO2021117345A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2021117345A1 (ja) | 2021-06-17 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230821 |