JPWO2021112194A1 - - Google Patents
Info
- Publication number
- JPWO2021112194A1 JPWO2021112194A1 JP2021562728A JP2021562728A JPWO2021112194A1 JP WO2021112194 A1 JPWO2021112194 A1 JP WO2021112194A1 JP 2021562728 A JP2021562728 A JP 2021562728A JP 2021562728 A JP2021562728 A JP 2021562728A JP WO2021112194 A1 JPWO2021112194 A1 JP WO2021112194A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019219931 | 2019-12-04 | ||
PCT/JP2020/045103 WO2021112194A1 (ja) | 2019-12-04 | 2020-12-03 | リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜、レジストパターン形成方法及び、回路パターン形成方法、オリゴマー、及び、精製方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021112194A1 true JPWO2021112194A1 (zh) | 2021-06-10 |
Family
ID=76221742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021562728A Pending JPWO2021112194A1 (zh) | 2019-12-04 | 2020-12-03 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021112194A1 (zh) |
TW (1) | TW202134792A (zh) |
WO (1) | WO2021112194A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240117101A1 (en) * | 2020-07-08 | 2024-04-11 | Mitsubishi Gas Chemical Company, Inc. | Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, composition for optical member formation, resin for underlayer film formation, resist resin, radiation-sensitive resin, and resin for underlayer film formation for lithography |
US20230391944A1 (en) * | 2020-08-28 | 2023-12-07 | Sekisui Chemical Co., Ltd. | Compound, method for producing compound, adhesive composition and adhesive tape |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5177418B2 (ja) * | 2008-12-12 | 2013-04-03 | 信越化学工業株式会社 | 反射防止膜形成材料、反射防止膜及びこれを用いたパターン形成方法 |
JP5485185B2 (ja) * | 2011-01-05 | 2014-05-07 | 信越化学工業株式会社 | レジスト下層膜材料及びこれを用いたパターン形成方法 |
WO2014171326A1 (ja) * | 2013-04-17 | 2014-10-23 | 日産化学工業株式会社 | レジスト下層膜形成組成物 |
JP6712188B2 (ja) * | 2015-07-13 | 2020-06-17 | 信越化学工業株式会社 | レジスト下層膜形成用組成物及びこれを用いたパターン形成方法 |
-
2020
- 2020-12-03 WO PCT/JP2020/045103 patent/WO2021112194A1/ja active Application Filing
- 2020-12-03 JP JP2021562728A patent/JPWO2021112194A1/ja active Pending
- 2020-12-04 TW TW109142861A patent/TW202134792A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2021112194A1 (ja) | 2021-06-10 |
TW202134792A (zh) | 2021-09-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231010 |