JPWO2021106272A1 - - Google Patents

Info

Publication number
JPWO2021106272A1
JPWO2021106272A1 JP2021561157A JP2021561157A JPWO2021106272A1 JP WO2021106272 A1 JPWO2021106272 A1 JP WO2021106272A1 JP 2021561157 A JP2021561157 A JP 2021561157A JP 2021561157 A JP2021561157 A JP 2021561157A JP WO2021106272 A1 JPWO2021106272 A1 JP WO2021106272A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021561157A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106272A1 publication Critical patent/JPWO2021106272A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/006—Anti-reflective coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021561157A 2019-11-26 2020-07-27 Pending JPWO2021106272A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019213086 2019-11-26
PCT/JP2020/028708 WO2021106272A1 (en) 2019-11-26 2020-07-27 Reinforcing film

Publications (1)

Publication Number Publication Date
JPWO2021106272A1 true JPWO2021106272A1 (en) 2021-06-03

Family

ID=76129343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561157A Pending JPWO2021106272A1 (en) 2019-11-26 2020-07-27

Country Status (5)

Country Link
JP (1) JPWO2021106272A1 (en)
KR (1) KR20220103727A (en)
CN (1) CN114729242A (en)
TW (1) TW202120643A (en)
WO (1) WO2021106272A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4037592B2 (en) * 2000-03-23 2008-01-23 株式会社きもと Thermosetting adhesive sheet for manufacturing reinforced flexible printed circuit board and method for manufacturing reinforced flexible printed circuit board
JP2006022313A (en) * 2004-06-11 2006-01-26 Toyo Ink Mfg Co Ltd Adhesive composition and pressure sensitive adhesive sheet using the same
JP2008169307A (en) * 2007-01-12 2008-07-24 Toyo Ink Mfg Co Ltd Adhesive composition and adhesive sheet using this
JP2008282020A (en) * 2008-05-12 2008-11-20 Nitto Denko Corp Optically compensatory plate, polarizing plate with optically compensatory layer using the same, method for producing the optically compensatory plate and liquid crystal display device using those
JP5647593B2 (en) * 2011-11-17 2015-01-07 株式会社有沢製作所 Protective film with carrier film
JP6279316B2 (en) * 2012-12-27 2018-02-14 日本合成化学工業株式会社 Method for producing acrylic resin for heat-resistant adhesive film
JP6347945B2 (en) * 2012-12-27 2018-06-27 日本合成化学工業株式会社 Method for producing acrylic resin for heat-resistant adhesive film
JP6613516B2 (en) 2014-07-07 2019-12-04 リンテック株式会社 Surface protection film
JP7154733B2 (en) * 2015-08-24 2022-10-18 日東電工株式会社 Optical components with surface protection film
JP6366199B2 (en) 2016-06-30 2018-08-01 日東電工株式会社 Reinforcing film with separator
WO2018021051A1 (en) * 2016-07-28 2018-02-01 日東電工株式会社 Separator-covered reinforcing film
CN110396379A (en) * 2019-07-16 2019-11-01 湖北锂诺新能源科技有限公司 A kind of lithium ion battery protective glue band carrying out laser coding

Also Published As

Publication number Publication date
TW202120643A (en) 2021-06-01
CN114729242A (en) 2022-07-08
KR20220103727A (en) 2022-07-22
WO2021106272A1 (en) 2021-06-03

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