JPWO2021106179A1 - - Google Patents
Info
- Publication number
- JPWO2021106179A1 JPWO2021106179A1 JP2021561095A JP2021561095A JPWO2021106179A1 JP WO2021106179 A1 JPWO2021106179 A1 JP WO2021106179A1 JP 2021561095 A JP2021561095 A JP 2021561095A JP 2021561095 A JP2021561095 A JP 2021561095A JP WO2021106179 A1 JPWO2021106179 A1 JP WO2021106179A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
- B29C64/194—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control during lay-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/364—Conditioning of environment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/046739 WO2021106179A1 (en) | 2019-11-29 | 2019-11-29 | Method for producing three-dimensionally shaped article by additive manufacturing, and device for producing three-dimensionally shaped article |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021106179A1 true JPWO2021106179A1 (en) | 2021-06-03 |
JP7325532B2 JP7325532B2 (en) | 2023-08-14 |
Family
ID=76129447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021561095A Active JP7325532B2 (en) | 2019-11-29 | 2019-11-29 | 3D object manufacturing method and 3D object manufacturing device by layered manufacturing method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7325532B2 (en) |
WO (1) | WO2021106179A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7295987B1 (en) | 2022-03-18 | 2023-06-21 | 株式会社ソディック | LAMINATED MAKING APPARATUS AND METHOD FOR MANUFACTURING LAMINATED PRODUCT |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005504654A (en) * | 2001-10-03 | 2005-02-17 | スリーディー システムズ インコーポレーテッド | Selective deposition modeling with curable phase change materials |
JP2015174284A (en) * | 2014-03-14 | 2015-10-05 | 富士機械製造株式会社 | Production method and production device of solid molded article |
JP2017183645A (en) * | 2016-03-31 | 2017-10-05 | コニカミノルタ株式会社 | Manufacturing method for three-dimensional molding |
WO2017187800A1 (en) * | 2016-04-26 | 2017-11-02 | 日東電工株式会社 | Shaping-stage adhesive sheet and lamination shaping device |
WO2017221347A1 (en) * | 2016-06-22 | 2017-12-28 | 富士機械製造株式会社 | Circuit formation method and circuit formation device |
-
2019
- 2019-11-29 WO PCT/JP2019/046739 patent/WO2021106179A1/en active Application Filing
- 2019-11-29 JP JP2021561095A patent/JP7325532B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005504654A (en) * | 2001-10-03 | 2005-02-17 | スリーディー システムズ インコーポレーテッド | Selective deposition modeling with curable phase change materials |
JP2015174284A (en) * | 2014-03-14 | 2015-10-05 | 富士機械製造株式会社 | Production method and production device of solid molded article |
JP2017183645A (en) * | 2016-03-31 | 2017-10-05 | コニカミノルタ株式会社 | Manufacturing method for three-dimensional molding |
WO2017187800A1 (en) * | 2016-04-26 | 2017-11-02 | 日東電工株式会社 | Shaping-stage adhesive sheet and lamination shaping device |
WO2017221347A1 (en) * | 2016-06-22 | 2017-12-28 | 富士機械製造株式会社 | Circuit formation method and circuit formation device |
Also Published As
Publication number | Publication date |
---|---|
JP7325532B2 (en) | 2023-08-14 |
WO2021106179A1 (en) | 2021-06-03 |
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