JPWO2021090630A1 - - Google Patents

Info

Publication number
JPWO2021090630A1
JPWO2021090630A1 JP2021554851A JP2021554851A JPWO2021090630A1 JP WO2021090630 A1 JPWO2021090630 A1 JP WO2021090630A1 JP 2021554851 A JP2021554851 A JP 2021554851A JP 2021554851 A JP2021554851 A JP 2021554851A JP WO2021090630 A1 JPWO2021090630 A1 JP WO2021090630A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554851A
Other languages
Japanese (ja)
Other versions
JP7625530B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021090630A1 publication Critical patent/JPWO2021090630A1/ja
Application granted granted Critical
Publication of JP7625530B2 publication Critical patent/JP7625530B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C08K5/25—Carboxylic acid hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021554851A 2019-11-08 2020-10-07 Insulating resin composition, cured insulating resin body, laminate and circuit board Active JP7625530B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019203454 2019-11-08
JP2019203454 2019-11-08
PCT/JP2020/038031 WO2021090630A1 (en) 2019-11-08 2020-10-07 Insulating resin composition, insulating resin cured body, layered body, and circuit base board

Publications (2)

Publication Number Publication Date
JPWO2021090630A1 true JPWO2021090630A1 (en) 2021-05-14
JP7625530B2 JP7625530B2 (en) 2025-02-03

Family

ID=75849913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554851A Active JP7625530B2 (en) 2019-11-08 2020-10-07 Insulating resin composition, cured insulating resin body, laminate and circuit board

Country Status (4)

Country Link
JP (1) JP7625530B2 (en)
CN (1) CN114341263A (en)
TW (1) TWI849247B (en)
WO (1) WO2021090630A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209132B2 (en) * 1997-02-27 2001-09-17 日立化成工業株式会社 Metal base substrate
JP2002012653A (en) * 2000-07-03 2002-01-15 Denki Kagaku Kogyo Kk Curable resin composition and metal-based circuit board using the same
JP2003026773A (en) 2001-07-17 2003-01-29 Nippon Kayaku Co Ltd Epoxy resin composition and flexible printed circuit board material using the same
JP3751271B2 (en) 2002-08-15 2006-03-01 電気化学工業株式会社 Resin composition for circuit board and metal base circuit board using the same
JP2005035397A (en) 2003-07-15 2005-02-10 Kaoru Shimizu Vehicle and driving assist method
JP2005353974A (en) * 2004-06-14 2005-12-22 Hitachi Chem Co Ltd Metal base circuit board
JP5444737B2 (en) * 2009-01-30 2014-03-19 株式会社オートネットワーク技術研究所 Flame retardant composition, insulated wire, and method for producing flame retardant composition
TW201307470A (en) * 2011-05-27 2013-02-16 Taiyo Ink Mfg Co Ltd Thermocuring resin composition, dry film and printed wiring board
JP6192635B2 (en) * 2012-03-30 2017-09-06 株式会社トクヤマ CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME, HIGHLY HEAT CONDUCTIVE RESIN COMPOSITION, AND HIGHLY HEAT CONDUCTIVE LAMINATE
CN105659711A (en) 2013-10-17 2016-06-08 住友电木株式会社 Epoxy-resin composition, carrier material with resin layer, metal-based circuit board, and electronic device
CN103641998B (en) * 2013-12-24 2016-05-04 江苏华海诚科新材料股份有限公司 The white epoxy resin composition that LED reflector is used
KR102310777B1 (en) * 2016-07-20 2021-10-07 쇼와덴코머티리얼즈가부시끼가이샤 Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and manufacturing method thereof
JP6919335B2 (en) 2017-05-29 2021-08-18 大日本印刷株式会社 Agricultural sheet
JP6284673B1 (en) 2017-07-05 2018-02-28 古河電気工業株式会社 RESIN COMPOSITION, RESIN COATING MATERIAL, AUTOMATIC WIRE HARNESS, AND AUTOMATIC WIRE HARNESS MANUFACTURING METHOD
CN110071206B (en) 2018-12-29 2021-09-17 博罗康佳精密科技有限公司 COB aluminum-based packaging plate and preparation process thereof
JP7304161B2 (en) * 2019-01-23 2023-07-06 デンカ株式会社 Insulating resin composition, insulating resin cured body, laminate and circuit board

Also Published As

Publication number Publication date
JP7625530B2 (en) 2025-02-03
TWI849247B (en) 2024-07-21
WO2021090630A1 (en) 2021-05-14
CN114341263A (en) 2022-04-12
TW202132461A (en) 2021-09-01

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