JPWO2021084706A1 - - Google Patents
Info
- Publication number
- JPWO2021084706A1 JPWO2021084706A1 JP2021554001A JP2021554001A JPWO2021084706A1 JP WO2021084706 A1 JPWO2021084706 A1 JP WO2021084706A1 JP 2021554001 A JP2021554001 A JP 2021554001A JP 2021554001 A JP2021554001 A JP 2021554001A JP WO2021084706 A1 JPWO2021084706 A1 JP WO2021084706A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/042878 WO2021084706A1 (en) | 2019-10-31 | 2019-10-31 | Polishing solution, polishing method, and semiconductor component manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021084706A1 true JPWO2021084706A1 (en) | 2021-05-06 |
JP7210823B2 JP7210823B2 (en) | 2023-01-24 |
Family
ID=75715014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021554001A Active JP7210823B2 (en) | 2019-10-31 | 2019-10-31 | Polishing liquid, polishing method and method for manufacturing semiconductor parts |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7210823B2 (en) |
TW (1) | TW202124617A (en) |
WO (1) | WO2021084706A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023243611A1 (en) * | 2022-06-15 | 2023-12-21 | 株式会社レゾナック | Cmp polishing liquid and polishing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590226A (en) * | 1991-01-22 | 1993-04-09 | Toshiba Corp | Manufacture of semiconductor device |
JP2008047816A (en) * | 2006-08-21 | 2008-02-28 | Fujifilm Corp | Polishing solution for metal |
WO2012102180A1 (en) * | 2011-01-27 | 2012-08-02 | 株式会社 フジミインコーポレーテッド | Polishing material and polishing composition |
JP2016510357A (en) * | 2013-01-30 | 2016-04-07 | キャボット マイクロエレクトロニクス コーポレイション | Chemical mechanical polishing composition comprising zirconia and a metal oxidant |
CN108138030A (en) * | 2015-10-02 | 2018-06-08 | 三星Sdi株式会社 | For organic film chemical and mechanical grinding paste material composition and use its grinding method |
-
2019
- 2019-10-31 WO PCT/JP2019/042878 patent/WO2021084706A1/en active Application Filing
- 2019-10-31 JP JP2021554001A patent/JP7210823B2/en active Active
-
2020
- 2020-10-29 TW TW109137636A patent/TW202124617A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590226A (en) * | 1991-01-22 | 1993-04-09 | Toshiba Corp | Manufacture of semiconductor device |
JP2008047816A (en) * | 2006-08-21 | 2008-02-28 | Fujifilm Corp | Polishing solution for metal |
WO2012102180A1 (en) * | 2011-01-27 | 2012-08-02 | 株式会社 フジミインコーポレーテッド | Polishing material and polishing composition |
JP2016510357A (en) * | 2013-01-30 | 2016-04-07 | キャボット マイクロエレクトロニクス コーポレイション | Chemical mechanical polishing composition comprising zirconia and a metal oxidant |
CN108138030A (en) * | 2015-10-02 | 2018-06-08 | 三星Sdi株式会社 | For organic film chemical and mechanical grinding paste material composition and use its grinding method |
Also Published As
Publication number | Publication date |
---|---|
WO2021084706A1 (en) | 2021-05-06 |
JP7210823B2 (en) | 2023-01-24 |
TW202124617A (en) | 2021-07-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211126 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221006 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221129 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221212 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 7210823 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |