JPWO2021084706A1 - - Google Patents

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Publication number
JPWO2021084706A1
JPWO2021084706A1 JP2021554001A JP2021554001A JPWO2021084706A1 JP WO2021084706 A1 JPWO2021084706 A1 JP WO2021084706A1 JP 2021554001 A JP2021554001 A JP 2021554001A JP 2021554001 A JP2021554001 A JP 2021554001A JP WO2021084706 A1 JPWO2021084706 A1 JP WO2021084706A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554001A
Other languages
Japanese (ja)
Other versions
JP7210823B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021084706A1 publication Critical patent/JPWO2021084706A1/ja
Application granted granted Critical
Publication of JP7210823B2 publication Critical patent/JP7210823B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2021554001A 2019-10-31 2019-10-31 Polishing liquid, polishing method and method for manufacturing semiconductor parts Active JP7210823B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/042878 WO2021084706A1 (en) 2019-10-31 2019-10-31 Polishing solution, polishing method, and semiconductor component manufacturing method

Publications (2)

Publication Number Publication Date
JPWO2021084706A1 true JPWO2021084706A1 (en) 2021-05-06
JP7210823B2 JP7210823B2 (en) 2023-01-24

Family

ID=75715014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554001A Active JP7210823B2 (en) 2019-10-31 2019-10-31 Polishing liquid, polishing method and method for manufacturing semiconductor parts

Country Status (3)

Country Link
JP (1) JP7210823B2 (en)
TW (1) TW202124617A (en)
WO (1) WO2021084706A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023243611A1 (en) * 2022-06-15 2023-12-21 株式会社レゾナック Cmp polishing liquid and polishing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590226A (en) * 1991-01-22 1993-04-09 Toshiba Corp Manufacture of semiconductor device
JP2008047816A (en) * 2006-08-21 2008-02-28 Fujifilm Corp Polishing solution for metal
WO2012102180A1 (en) * 2011-01-27 2012-08-02 株式会社 フジミインコーポレーテッド Polishing material and polishing composition
JP2016510357A (en) * 2013-01-30 2016-04-07 キャボット マイクロエレクトロニクス コーポレイション Chemical mechanical polishing composition comprising zirconia and a metal oxidant
CN108138030A (en) * 2015-10-02 2018-06-08 三星Sdi株式会社 For organic film chemical and mechanical grinding paste material composition and use its grinding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590226A (en) * 1991-01-22 1993-04-09 Toshiba Corp Manufacture of semiconductor device
JP2008047816A (en) * 2006-08-21 2008-02-28 Fujifilm Corp Polishing solution for metal
WO2012102180A1 (en) * 2011-01-27 2012-08-02 株式会社 フジミインコーポレーテッド Polishing material and polishing composition
JP2016510357A (en) * 2013-01-30 2016-04-07 キャボット マイクロエレクトロニクス コーポレイション Chemical mechanical polishing composition comprising zirconia and a metal oxidant
CN108138030A (en) * 2015-10-02 2018-06-08 三星Sdi株式会社 For organic film chemical and mechanical grinding paste material composition and use its grinding method

Also Published As

Publication number Publication date
WO2021084706A1 (en) 2021-05-06
JP7210823B2 (en) 2023-01-24
TW202124617A (en) 2021-07-01

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