JPWO2021079913A1 - - Google Patents
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- Publication number
- JPWO2021079913A1 JPWO2021079913A1 JP2021553500A JP2021553500A JPWO2021079913A1 JP WO2021079913 A1 JPWO2021079913 A1 JP WO2021079913A1 JP 2021553500 A JP2021553500 A JP 2021553500A JP 2021553500 A JP2021553500 A JP 2021553500A JP WO2021079913 A1 JPWO2021079913 A1 JP WO2021079913A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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JP2019193437 | 2019-10-24 | ||
PCT/JP2020/039584 WO2021079913A1 (ja) | 2019-10-24 | 2020-10-21 | 半導体装置 |
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JP5509461B2 (ja) | 2008-12-25 | 2014-06-04 | 三菱電機株式会社 | パワー半導体装置およびその製造方法 |
EP2447989B1 (en) * | 2009-06-22 | 2016-05-04 | Mitsubishi Electric Corporation | Semiconductor package and semiconductor package mounting structure |
JP6300633B2 (ja) | 2014-05-20 | 2018-03-28 | 三菱電機株式会社 | パワーモジュール |
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