JPWO2021070442A1 - - Google Patents

Info

Publication number
JPWO2021070442A1
JPWO2021070442A1 JP2021550359A JP2021550359A JPWO2021070442A1 JP WO2021070442 A1 JPWO2021070442 A1 JP WO2021070442A1 JP 2021550359 A JP2021550359 A JP 2021550359A JP 2021550359 A JP2021550359 A JP 2021550359A JP WO2021070442 A1 JPWO2021070442 A1 JP WO2021070442A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021550359A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021070442A1 publication Critical patent/JPWO2021070442A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/09—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
JP2021550359A 2019-10-11 2020-07-15 Pending JPWO2021070442A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019187732 2019-10-11
PCT/JP2020/027513 WO2021070442A1 (en) 2019-10-11 2020-07-15 Package and method for producing same, and cover glass and method for producing same

Publications (1)

Publication Number Publication Date
JPWO2021070442A1 true JPWO2021070442A1 (en) 2021-04-15

Family

ID=75437089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021550359A Pending JPWO2021070442A1 (en) 2019-10-11 2020-07-15

Country Status (3)

Country Link
JP (1) JPWO2021070442A1 (en)
TW (1) TW202128584A (en)
WO (1) WO2021070442A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023128345A (en) * 2022-03-03 2023-09-14 日東電工株式会社 Brittle material chip, brittle material sheet, method for manufacturing brittle material sheet and method for manufacturing brittle material chip

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221541A (en) * 2002-11-15 2004-08-05 Nippon Electric Glass Co Ltd Cover glass for solid imaging devices
JP2005086100A (en) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd Solid state imaging apparatus
JP2006041201A (en) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Packaged electronic part and its manufacturing method
WO2006041074A1 (en) * 2004-10-12 2006-04-20 Nippon Electric Glass Co., Ltd. Cover glass for solid image pickup device and process for producing the same
JP2006303482A (en) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd Manufacturing method of solid-state imaging device
JP2008227232A (en) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof, and optical pickup module
JP2014230083A (en) * 2013-05-22 2014-12-08 オリンパス株式会社 Imaging apparatus, imaging apparatus manufacturing method, and endoscope system
WO2017094502A1 (en) * 2015-11-30 2017-06-08 ソニー株式会社 Solid-state image capture device, method for manufacturing same, and electronic device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221541A (en) * 2002-11-15 2004-08-05 Nippon Electric Glass Co Ltd Cover glass for solid imaging devices
JP2005086100A (en) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd Solid state imaging apparatus
JP2006041201A (en) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Packaged electronic part and its manufacturing method
WO2006041074A1 (en) * 2004-10-12 2006-04-20 Nippon Electric Glass Co., Ltd. Cover glass for solid image pickup device and process for producing the same
JP2006303482A (en) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd Manufacturing method of solid-state imaging device
JP2008227232A (en) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof, and optical pickup module
JP2014230083A (en) * 2013-05-22 2014-12-08 オリンパス株式会社 Imaging apparatus, imaging apparatus manufacturing method, and endoscope system
WO2017094502A1 (en) * 2015-11-30 2017-06-08 ソニー株式会社 Solid-state image capture device, method for manufacturing same, and electronic device

Also Published As

Publication number Publication date
WO2021070442A1 (en) 2021-04-15
TW202128584A (en) 2021-08-01

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