JPWO2021065509A1 - - Google Patents
Info
- Publication number
- JPWO2021065509A1 JPWO2021065509A1 JP2021550585A JP2021550585A JPWO2021065509A1 JP WO2021065509 A1 JPWO2021065509 A1 JP WO2021065509A1 JP 2021550585 A JP2021550585 A JP 2021550585A JP 2021550585 A JP2021550585 A JP 2021550585A JP WO2021065509 A1 JPWO2021065509 A1 JP WO2021065509A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019179782 | 2019-09-30 | ||
PCT/JP2020/035061 WO2021065509A1 (en) | 2019-09-30 | 2020-09-16 | Polyimide resin composition, polyimide varnish, polyimide film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021065509A1 true JPWO2021065509A1 (en) | 2021-04-08 |
Family
ID=75338027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021550585A Pending JPWO2021065509A1 (en) | 2019-09-30 | 2020-09-16 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021065509A1 (en) |
KR (1) | KR20220075327A (en) |
CN (1) | CN114466902A (en) |
TW (1) | TW202120595A (en) |
WO (1) | WO2021065509A1 (en) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006206825A (en) * | 2005-01-31 | 2006-08-10 | Jfe Chemical Corp | Aromatic polyimide resin precursor and aromatic polyimide resin |
JP2009079165A (en) * | 2007-09-27 | 2009-04-16 | Du Pont Toray Co Ltd | Polyimide film |
US9365694B2 (en) * | 2012-07-27 | 2016-06-14 | Samsung Electronics Co., Ltd. | Composition including polyimide block copolymer and inorganic particles, method of preparing same, article including same, and display device including the article |
TWI488887B (en) * | 2013-02-08 | 2015-06-21 | 長興材料工業股份有限公司 | Polyimides, coating composition formed therefrom and use thereof |
JP6294116B2 (en) * | 2013-03-29 | 2018-03-14 | 住友電気工業株式会社 | Polyimide precursor resin composition, polyimide resin film, flexible printed wiring board, suspension with circuit, and hard disk drive |
CN103755959B (en) * | 2014-01-22 | 2016-03-02 | 江苏亚宝绝缘材料股份有限公司 | A kind of Flexible transparent polyimide thin film |
JP6599620B2 (en) * | 2015-03-05 | 2019-10-30 | 旭化成株式会社 | Optical member using polyimide as an adhesive layer |
CN105254886A (en) * | 2015-11-02 | 2016-01-20 | 株洲时代新材料科技股份有限公司 | Polyamide acid resin composition and thermoplastic polyimide thin film as well as preparation methods thereof |
CN105778498A (en) * | 2016-03-18 | 2016-07-20 | 江苏亚宝绝缘材料股份有限公司 | Black polyimide film |
TWI804465B (en) * | 2016-05-02 | 2023-06-11 | 日商三菱瓦斯化學股份有限公司 | Polyimide resin, polyimide resin composition, and polyimide film |
WO2018100324A1 (en) * | 2016-12-02 | 2018-06-07 | Rhodia Operations | Suspension of cerium oxide |
KR20200052308A (en) | 2017-09-29 | 2020-05-14 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Polyimide resin, polyimide varnish and polyimide film |
WO2019065521A1 (en) * | 2017-09-29 | 2019-04-04 | 三菱瓦斯化学株式会社 | Polyimide, polyimide varnish, and polyimide film |
JP7424284B2 (en) * | 2018-03-28 | 2024-01-30 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide varnish and polyimide film |
JPWO2019188306A1 (en) * | 2018-03-28 | 2021-03-11 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide varnish and polyimide film |
WO2019188265A1 (en) * | 2018-03-30 | 2019-10-03 | 株式会社カネカ | Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film |
KR20210138568A (en) * | 2019-03-14 | 2021-11-19 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Polyimide resin composition |
-
2020
- 2020-09-16 KR KR1020227009879A patent/KR20220075327A/en active Search and Examination
- 2020-09-16 CN CN202080067488.3A patent/CN114466902A/en active Pending
- 2020-09-16 JP JP2021550585A patent/JPWO2021065509A1/ja active Pending
- 2020-09-16 WO PCT/JP2020/035061 patent/WO2021065509A1/en active Application Filing
- 2020-09-18 TW TW109132211A patent/TW202120595A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202120595A (en) | 2021-06-01 |
CN114466902A (en) | 2022-05-10 |
WO2021065509A1 (en) | 2021-04-08 |
KR20220075327A (en) | 2022-06-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230719 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240528 |