JPWO2021059914A1 - - Google Patents
Info
- Publication number
- JPWO2021059914A1 JPWO2021059914A1 JP2021548740A JP2021548740A JPWO2021059914A1 JP WO2021059914 A1 JPWO2021059914 A1 JP WO2021059914A1 JP 2021548740 A JP2021548740 A JP 2021548740A JP 2021548740 A JP2021548740 A JP 2021548740A JP WO2021059914 A1 JPWO2021059914 A1 JP WO2021059914A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019174323 | 2019-09-25 | ||
PCT/JP2020/033435 WO2021059914A1 (ja) | 2019-09-25 | 2020-09-03 | 電子回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021059914A1 true JPWO2021059914A1 (zh) | 2021-04-01 |
Family
ID=75166596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021548740A Pending JPWO2021059914A1 (zh) | 2019-09-25 | 2020-09-03 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021059914A1 (zh) |
DE (1) | DE112020004544T5 (zh) |
WO (1) | WO2021059914A1 (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134039U (zh) * | 1986-01-16 | 1986-08-21 | ||
JPH08222671A (ja) * | 1994-12-14 | 1996-08-30 | Toshiba Corp | 回路モジュールの冷却装置 |
JP2002344177A (ja) * | 2001-05-17 | 2002-11-29 | Denso Corp | 電子装置 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
WO2014046004A1 (ja) * | 2012-09-21 | 2014-03-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2015047031A (ja) * | 2013-08-29 | 2015-03-12 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP2019067788A (ja) * | 2017-09-28 | 2019-04-25 | 日本シイエムケイ株式会社 | プリント配線板用放熱金属片素材と当該放熱金属片素材を用いたプリント配線板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6208072B2 (ja) | 2014-04-28 | 2017-10-04 | 日立オートモティブシステムズ株式会社 | 電子回路装置およびその製造方法 |
JP7191312B2 (ja) | 2018-03-29 | 2022-12-19 | シヤチハタ株式会社 | 識別タグ、その干渉波形検出方法及びその真贋判定方法 |
-
2020
- 2020-09-03 JP JP2021548740A patent/JPWO2021059914A1/ja active Pending
- 2020-09-03 WO PCT/JP2020/033435 patent/WO2021059914A1/ja active Application Filing
- 2020-09-03 DE DE112020004544.7T patent/DE112020004544T5/de active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134039U (zh) * | 1986-01-16 | 1986-08-21 | ||
JPH08222671A (ja) * | 1994-12-14 | 1996-08-30 | Toshiba Corp | 回路モジュールの冷却装置 |
JP2002344177A (ja) * | 2001-05-17 | 2002-11-29 | Denso Corp | 電子装置 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
WO2014046004A1 (ja) * | 2012-09-21 | 2014-03-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2015047031A (ja) * | 2013-08-29 | 2015-03-12 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP2019067788A (ja) * | 2017-09-28 | 2019-04-25 | 日本シイエムケイ株式会社 | プリント配線板用放熱金属片素材と当該放熱金属片素材を用いたプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2021059914A1 (ja) | 2021-04-01 |
DE112020004544T5 (de) | 2022-06-09 |
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