JPWO2021044589A1 - - Google Patents

Info

Publication number
JPWO2021044589A1
JPWO2021044589A1 JP2021543898A JP2021543898A JPWO2021044589A1 JP WO2021044589 A1 JPWO2021044589 A1 JP WO2021044589A1 JP 2021543898 A JP2021543898 A JP 2021543898A JP 2021543898 A JP2021543898 A JP 2021543898A JP WO2021044589 A1 JPWO2021044589 A1 JP WO2021044589A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021543898A
Other versions
JP7363905B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021044589A1 publication Critical patent/JPWO2021044589A1/ja
Priority to JP2023158467A priority Critical patent/JP2023174688A/ja
Application granted granted Critical
Publication of JP7363905B2 publication Critical patent/JP7363905B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2021543898A 2019-09-05 2019-09-05 離型フィルム及び半導体パッケージの製造方法 Active JP7363905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023158467A JP2023174688A (ja) 2019-09-05 2023-09-22 離型フィルム及び半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035010 WO2021044589A1 (ja) 2019-09-05 2019-09-05 離型フィルム及び半導体パッケージの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023158467A Division JP2023174688A (ja) 2019-09-05 2023-09-22 離型フィルム及び半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPWO2021044589A1 true JPWO2021044589A1 (ja) 2021-03-11
JP7363905B2 JP7363905B2 (ja) 2023-10-18

Family

ID=74853319

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021543898A Active JP7363905B2 (ja) 2019-09-05 2019-09-05 離型フィルム及び半導体パッケージの製造方法
JP2023158467A Pending JP2023174688A (ja) 2019-09-05 2023-09-22 離型フィルム及び半導体パッケージの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023158467A Pending JP2023174688A (ja) 2019-09-05 2023-09-22 離型フィルム及び半導体パッケージの製造方法

Country Status (5)

Country Link
JP (2) JP7363905B2 (ja)
KR (1) KR20220057545A (ja)
CN (1) CN114342051A (ja)
TW (1) TWI833987B (ja)
WO (1) WO2021044589A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230151995A (ko) * 2021-02-25 2023-11-02 에이지씨 가부시키가이샤 필름 및 그 제조 방법, 그리고 반도체 패키지의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014113703A (ja) * 2012-12-06 2014-06-26 Mitsui Chemicals Tohcello Inc Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法
WO2015133634A1 (ja) * 2014-03-07 2015-09-11 旭硝子株式会社 離型フィルム、および封止体の製造方法
WO2016125796A1 (ja) * 2015-02-06 2016-08-11 旭硝子株式会社 フィルム、その製造方法および該フィルムを用いた半導体素子の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005186740A (ja) 2003-12-25 2005-07-14 Aisin Seiki Co Ltd 車両の変速制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014113703A (ja) * 2012-12-06 2014-06-26 Mitsui Chemicals Tohcello Inc Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法
WO2015133634A1 (ja) * 2014-03-07 2015-09-11 旭硝子株式会社 離型フィルム、および封止体の製造方法
WO2016125796A1 (ja) * 2015-02-06 2016-08-11 旭硝子株式会社 フィルム、その製造方法および該フィルムを用いた半導体素子の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
石原英昭 ほか: "ポリブチレンテレフタレート/熱可塑性ポリエステルエラストマーのブレンド系における構造と物性", 成形加工, vol. 24, no. 11, JPN6019042260, 2012, pages 651 - 659, ISSN: 0005077564 *

Also Published As

Publication number Publication date
TW202116951A (zh) 2021-05-01
CN114342051A (zh) 2022-04-12
TWI833987B (zh) 2024-03-01
KR20220057545A (ko) 2022-05-09
JP7363905B2 (ja) 2023-10-18
WO2021044589A1 (ja) 2021-03-11
JP2023174688A (ja) 2023-12-08

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