JPWO2021044506A1 - - Google Patents
Info
- Publication number
- JPWO2021044506A1 JPWO2021044506A1 JP2021543830A JP2021543830A JPWO2021044506A1 JP WO2021044506 A1 JPWO2021044506 A1 JP WO2021044506A1 JP 2021543830 A JP2021543830 A JP 2021543830A JP 2021543830 A JP2021543830 A JP 2021543830A JP WO2021044506 A1 JPWO2021044506 A1 JP WO2021044506A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/034523 WO2021044506A1 (ja) | 2019-09-03 | 2019-09-03 | 作業機、および部品装着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021044506A1 true JPWO2021044506A1 (US06633600-20031014-M00021.png) | 2021-03-11 |
| JP7429701B2 JP7429701B2 (ja) | 2024-02-08 |
Family
ID=74852028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021543830A Active JP7429701B2 (ja) | 2019-09-03 | 2019-09-03 | 作業機、および部品装着方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7429701B2 (US06633600-20031014-M00021.png) |
| WO (1) | WO2021044506A1 (US06633600-20031014-M00021.png) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4606120A (en) * | 1983-10-26 | 1986-08-19 | General Electric Company | Process for mounting components on a printed circuit board |
| JPS61138260U (US06633600-20031014-M00021.png) * | 1985-02-15 | 1986-08-27 | ||
| JPS63170980U (US06633600-20031014-M00021.png) * | 1987-04-27 | 1988-11-07 | ||
| JPH0499600U (US06633600-20031014-M00021.png) * | 1991-01-28 | 1992-08-27 | ||
| JPH098434A (ja) * | 1995-06-19 | 1997-01-10 | Nippondenso Co Ltd | 電子回路ユニット及びその製造方法 |
| JP2009064823A (ja) * | 2007-09-04 | 2009-03-26 | Fujitsu Telecom Networks Ltd | Ｌｅｄ取付用スペーサ |
| WO2017068638A1 (ja) * | 2015-10-20 | 2017-04-27 | 富士機械製造株式会社 | 画像処理装置および部品実装機 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6186302B2 (ja) | 2013-04-22 | 2017-08-23 | 株式会社フロンティアエンジニアリング | ジュール加熱装置 |
| JP6528123B2 (ja) | 2015-05-15 | 2019-06-12 | パナソニックＩｐマネジメント株式会社 | 部品取出し装置および部品取出し方法ならびに部品実装装置 |
-
2019
- 2019-09-03 JP JP2021543830A patent/JP7429701B2/ja active Active
- 2019-09-03 WO PCT/JP2019/034523 patent/WO2021044506A1/ja active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4606120A (en) * | 1983-10-26 | 1986-08-19 | General Electric Company | Process for mounting components on a printed circuit board |
| JPS61138260U (US06633600-20031014-M00021.png) * | 1985-02-15 | 1986-08-27 | ||
| JPS63170980U (US06633600-20031014-M00021.png) * | 1987-04-27 | 1988-11-07 | ||
| JPH0499600U (US06633600-20031014-M00021.png) * | 1991-01-28 | 1992-08-27 | ||
| JPH098434A (ja) * | 1995-06-19 | 1997-01-10 | Nippondenso Co Ltd | 電子回路ユニット及びその製造方法 |
| JP2009064823A (ja) * | 2007-09-04 | 2009-03-26 | Fujitsu Telecom Networks Ltd | Ｌｅｄ取付用スペーサ |
| WO2017068638A1 (ja) * | 2015-10-20 | 2017-04-27 | 富士機械製造株式会社 | 画像処理装置および部品実装機 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7429701B2 (ja) | 2024-02-08 |
| WO2021044506A1 (ja) | 2021-03-11 |
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