JPWO2021038772A1 - - Google Patents

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Publication number
JPWO2021038772A1
JPWO2021038772A1 JP2021541884A JP2021541884A JPWO2021038772A1 JP WO2021038772 A1 JPWO2021038772 A1 JP WO2021038772A1 JP 2021541884 A JP2021541884 A JP 2021541884A JP 2021541884 A JP2021541884 A JP 2021541884A JP WO2021038772 A1 JPWO2021038772 A1 JP WO2021038772A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021541884A
Other languages
Japanese (ja)
Other versions
JP7459878B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021038772A1 publication Critical patent/JPWO2021038772A1/ja
Application granted granted Critical
Publication of JP7459878B2 publication Critical patent/JP7459878B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021541884A 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 Active JP7459878B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/033794 WO2021038772A1 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Publications (2)

Publication Number Publication Date
JPWO2021038772A1 true JPWO2021038772A1 (ko) 2021-03-04
JP7459878B2 JP7459878B2 (ja) 2024-04-02

Family

ID=74684034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021541884A Active JP7459878B2 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Country Status (4)

Country Link
JP (1) JP7459878B2 (ko)
KR (1) KR20220055470A (ko)
CN (1) CN114174372A (ko)
WO (1) WO2021038772A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189554A (ja) * 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2012111543A1 (ja) * 2011-02-18 2012-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張積層板
CN106752452A (zh) * 2016-12-07 2017-05-31 江西龙正科技发展有限公司 一种led灯具用散热涂料

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408543B (zh) 2006-11-15 2014-10-29 日立化成工业株式会社 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置
EP2540776B1 (en) * 2007-09-25 2017-08-09 Hitachi Chemical Co., Ltd. Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
JP2018070680A (ja) * 2016-10-25 2018-05-10 日立化成株式会社 エポキシ樹脂組成物及びこれを用いたエポキシ樹脂硬化物、電子部品装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189554A (ja) * 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2012111543A1 (ja) * 2011-02-18 2012-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張積層板
CN106752452A (zh) * 2016-12-07 2017-05-31 江西龙正科技发展有限公司 一种led灯具用散热涂料

Also Published As

Publication number Publication date
CN114174372A (zh) 2022-03-11
WO2021038772A1 (ja) 2021-03-04
JP7459878B2 (ja) 2024-04-02
KR20220055470A (ko) 2022-05-03

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