JPWO2021038766A1 - - Google Patents

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Publication number
JPWO2021038766A1
JPWO2021038766A1 JP2021541878A JP2021541878A JPWO2021038766A1 JP WO2021038766 A1 JPWO2021038766 A1 JP WO2021038766A1 JP 2021541878 A JP2021541878 A JP 2021541878A JP 2021541878 A JP2021541878 A JP 2021541878A JP WO2021038766 A1 JPWO2021038766 A1 JP WO2021038766A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021541878A
Other versions
JP7294429B2 (ja
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Publication date
Application filed filed Critical
Publication of JPWO2021038766A1 publication Critical patent/JPWO2021038766A1/ja
Application granted granted Critical
Publication of JP7294429B2 publication Critical patent/JP7294429B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021541878A 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 Active JP7294429B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/033769 WO2021038766A1 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Publications (2)

Publication Number Publication Date
JPWO2021038766A1 true JPWO2021038766A1 (ja) 2021-03-04
JP7294429B2 JP7294429B2 (ja) 2023-06-20

Family

ID=74683422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021541878A Active JP7294429B2 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Country Status (4)

Country Link
JP (1) JP7294429B2 (ja)
KR (1) KR20220055471A (ja)
CN (1) CN114127185A (ja)
WO (1) WO2021038766A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041472A1 (ja) * 2007-09-25 2009-04-02 Hitachi Chemical Company, Ltd. 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
WO2017131152A1 (ja) * 2016-01-27 2017-08-03 クラスターテクノロジー株式会社 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060707B2 (ja) 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041472A1 (ja) * 2007-09-25 2009-04-02 Hitachi Chemical Company, Ltd. 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
WO2017131152A1 (ja) * 2016-01-27 2017-08-03 クラスターテクノロジー株式会社 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Also Published As

Publication number Publication date
JP7294429B2 (ja) 2023-06-20
WO2021038766A1 (ja) 2021-03-04
KR20220055471A (ko) 2022-05-03
CN114127185A (zh) 2022-03-01

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